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Packaging structure of alternating current light-emitting diode

A technology of light-emitting diodes and packaging structures, which can be applied to electrical components, electrical solid-state devices, circuits, etc., and can solve problems such as breakdown of LED chips and electric shock.

Inactive Publication Date: 2010-11-10
FORWARD ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When AC LED products are in operation, because the LED chip is directly in contact with the AC voltage supplied by the mains, there is a potential problem compared with the previous DC LED, that is, there may be a high voltage breakdown of the LED chip. This will lead to electric shock when the human body touches the LED device body

Method used

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  • Packaging structure of alternating current light-emitting diode
  • Packaging structure of alternating current light-emitting diode
  • Packaging structure of alternating current light-emitting diode

Examples

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Embodiment Construction

[0024] The present invention mainly increases the distance between the AC light-emitting diode chip and its supporting seat (also a heat dissipation block), so as to prevent the high-voltage power supply from passing through the carrying seat due to an arc when the gold wire and the diode chip flow, causing danger of human body contact.

[0025] refer to figure 2 , is a schematic diagram of the packaging structure of an AC light emitting diode according to a preferred embodiment of the present invention. The figure shows an AC LED package structure including a heat sink 11 , an AC LED module 12 , an insulator substrate 15 , a positive pole support 13 , and a negative pole support 14 . In this example, the AC LED module 12 is composed of a plurality of AC LED chips 121-124 connected in series, and the insulator substrate 15 includes a plurality of sub-substrate blocks 151-154 corresponding to the above-mentioned AC LED chips 121-124.

[0026] The plurality of insulator substr...

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PUM

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Abstract

The invention relates to a packaging structure of an alternating current light-emitting diode, which comprises a heat radiation block, an alternating current light-emitting diode module, a positive pole support, a negative pole support and an insulator substrate, wherein the alternating current light-emitting diode module is electrically connected with the positive pole support and the negative pole support, the insulator substrate is positioned between the alternating current light-emitting diode module and the heat radiation block, and the insulator substrate has the property that the voltage resistance value is larger than 1000V. Therefore, the packaging structure can avoid the risk that the alternating current light-emitting diode device produces high voltage for breaking down a diode chip and further causing electric shock of a person, and a product also meets the requirements of safety certification.

Description

technical field [0001] The present invention relates to an AC LED (Alternate Current Light Emitting Diode; AC LED), in particular to an AC LED packaging structure with high voltage resistance. Background technique [0002] refer to figure 1 , is a schematic diagram of a known light emitting diode package structure. The figure shows that the known light-emitting diode packaging structure is mainly to carry an LED chip (chip) 2 on a heat sink (slug) 1, and lead out two gold wires 3 from the LED chip 2 to electrically connect each to the anode support. 4 and negative pole support 5. The anode support 4 and the anode support 5 are used to connect a power source (not shown) to make the LED device operate and emit light. [0003] When AC LED products are in operation, because the LED chip is directly in contact with the AC voltage supplied by the mains, there is a potential problem compared with the previous DC LED, that is, there may be a situation where the high voltage break...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075
CPCH01L2224/48091H01L2224/48247
Inventor 蓝培轩陈瑞鸿杨仁华蓝钰邴
Owner FORWARD ELECTRONICS CO LTD