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Heat sink

A heat dissipation device and heat sink technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problem of low heat dissipation efficiency and achieve the effect of improving heat dissipation efficiency

Inactive Publication Date: 2010-11-17
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional radiators can only dissipate heat for a single electronic component, and the heat dissipation efficiency is not high

Method used

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Experimental program
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Effect test

Embodiment Construction

[0008] see figure 1 The heat dissipation device of the present invention includes a heat sink 10 , a fan 30 installed on one side of the heat sink 10 and a fan fixing frame 40 for fixing the fan 30 to the heat sink 10 .

[0009] The heat sink 10 includes a base 15 on which a heat pipe 12 is fixed, and a plurality of cooling fins 11 perpendicular to the upper surface of the base 15 are arranged on the heat pipe 12 sequentially. The lower surface of the base 15 can be in contact with an element to be radiated (such as a central processing unit) on a computer motherboard, and the heat generated by the element to be radiated is transmitted to the heat sink 11 by the base 15 through the heat pipe 12 . The base 15 includes a heat conducting plate 151 and a fixing plate 152 . The lower surface of the heat conducting plate 151 is in contact with the components to be dissipated, and the upper surface of the heat conducting plate 151 is provided with a plurality of grooves (not shown) ...

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PUM

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Abstract

The invention relates to a heat sink, comprising a radiator and a fan mounted at one side of the radiator. The radiator comprises a base in thermal contact with an element to be radiated and a radiating rib fixed with the base together; a slant slot is formed at the other side close to the radiator in the radiating rib; the edges of the slot are bent to jointly form a wind slope which forms a slant included angle with the airflow direction of the fan; and the airflow of the fan blowing over the radiator is guided to other elements in need of heat radiation. The heat sink of the invention can guide airflow to other elements in need of heat radiation through the wind slope, thereby improving radiating efficiency.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device capable of simultaneously dissipating heat from a plurality of heating elements. Background technique [0002] With the continuous improvement of the output power and operating frequency of electronic components such as central processing units, the corresponding heat generated by them has also increased significantly. If the heat generated is not removed in time, it will cause heat accumulation and cause temperature rise, which will seriously affect electronic components. of normal operation. For this reason, the industry usually installs a heat sink on the surface of these heat-generating electronic components for auxiliary heat dissipation, and at the same time installs a fan on the heat sink to enhance the heat dissipation effect. Traditional heat sinks can only dissipate heat for a single electronic component, and the heat dissipation efficiency is not ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/467G06F1/20
CPCH01L23/467H01L23/427H01L23/4006H01L2924/0002H01L2924/00
Inventor 曹亮亮林有旭
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD