Measuring method of package thermal strain of radio frequency micro electromechanical system device
A micro-electromechanical system and device packaging technology, applied in the direction of electric/magnetic solid deformation measurement, electromagnetic measurement device, etc., can solve the problem that the measurement accuracy is affected by the size and accuracy of the grating, the measurement accuracy is affected by the shape and scale of the structure, and the measurement Accuracy and sensitivity are not high, to achieve the effect of online measurement, reduce measurement cost, and simplify the measurement process
Inactive Publication Date: 2012-01-18
SOUTHEAST UNIV
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Problems solved by technology
The current measurement methods for thermal strain of MEMS device packaging mainly include: (1) Optical microscopic measurement method, the basic principle of which is to measure the deformation of a specific test structure such as a strain gauge under thermal stress to determine the thermal strain of the package. The disadvantage is that the measurement The accuracy is affected by the shape and scale of the structure, and the measurement error is relatively large; (2) Optical interferometry, such as moiré interference fringe method, the basic principle is to combine the specimen grid that is made on the surface of the structure and deforms with the structure with the sample grid that does not deform with the structure The reference gratings are in contact with each other and overlap, thus forming moiré due to interference. The moiré can be analyzed to measure the thermal strain of the package. The disadvantage is that the measurement accuracy is affected by the scale and precision of the grating, and the measurement accuracy and sensitivity are not high.
And the above optical methods all need special measuring instruments and measuring methods
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[0018] Example: such as figure 1 , image 3 and Figure 4 As shown, a method for measuring thermal strain of RF MEMS device packaging includes the following steps:
[0019] (1) Simultaneous production of test units with RF MEMS devices:
[0020] Sputter the metal film on the low-loss substrate and etch to form a coplanar waveguide; deposit a layer of insulating dielectric film and etch only the part covering the overlapping area of the coplanar waveguide signal line and the double-terminal fixed support beam; spin coating sacrificial Layer, etch the anchor area window of the double-end fixed beam on the sacrificial layer; sputter the metal film and etch to form the beam structure, and then electroplate to thicken it; finally remove the sacrificial layer by wet etching to release the beam structure;
[0021] (2) if figure 2 As shown, the phase shift characteristics of the test unit before packaging are measured with a microwave network measurement system consisting of a...
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The invention discloses a measuring method of package thermal strain of radio frequency micro electromechanical system device (RF MEMS), wherein the specified position of a substrate and the RF MEMS device are provided synchronously with a group or a plurality of groups of test units which are load transmission lines consisting of high impedance coplanar waveguide and a plurality of dual-end fixing beam spanned on it periodically; the relation between the mechanical characteristics and the electrical characteristics of the load transmission line is used for determining the RF MEMS device package thermal strain. The invention measures the RF MEMS device package thermal strain by using microwave measuring means; the manufacture of the test unit is compatible to the manufacturing technique of the RF MEMS device, which can be carried out synchronously.
Description
technical field [0001] The invention relates to a method for measuring thermal strain of a radio frequency microelectromechanical system device package. Background technique [0002] Radio frequency microelectromechanical system, referred to as: RF MEMS. The current measurement methods for thermal strain of MEMS device packaging mainly include: (1) optical microscopic measurement method, the basic principle of which is to measure the deformation of a specific test structure such as a strain gauge under thermal stress to determine the thermal strain of the package. The disadvantage is that the measurement The accuracy is affected by the shape and scale of the structure, and the measurement error is relatively large; (2) Optical interferometry, such as moiré interference fringe method, the basic principle is to combine the specimen grid that is made on the surface of the structure and deforms with the structure with the grid that does not deform with the structure The referen...
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IPC IPC(8): G01B7/16
Inventor 赵成黄庆安宋竟
Owner SOUTHEAST UNIV