Method for expanding low-capacity NAND flash chips into high-capacity module

An expansion module, large-capacity technology, applied in sustainable buildings, energy-saving computing, climate sustainability, etc., can solve the problems of inconvenient purchase, unstable supply, etc., to achieve the effect of convenient portability and guarantee of standardization

Inactive Publication Date: 2010-12-01
邓昕岳
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

NAND FLASH chips are increasingly developing in the need for large-capacity data storage. NAND FLASH chips can be seen in almost all digital products, but for occasions that require large capacities, such as more than 20GB, single-chip NAND FLASH chips It cannot be done, or even if it can be done, it is either inconvenient for ordinary users to purchase, or the supply is unstable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for expanding low-capacity NAND flash chips into high-capacity module
  • Method for expanding low-capacity NAND flash chips into high-capacity module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0013] In the figure, 4 NAND FLASH chips are used, and the user can add up to 16 NAND FLASH chips as needed, as long as the models of the NAND FLASH chips are consistent. When making PCB, if the space permits, several packages of NAND FLASH chips can be reserved, and the user can choose whether to use all or part of them according to the needs of the application. When the capacity requirement changes, the NAND FLASH chip on the PCB can also be removed, and a larger capacity NAND FLASH chip can be re-soldered. The module can realize arbitrary expansion and flexible customization of NAND FLASH capacity, and has little impact on the NAND FLASH interface, ensuring the standardization of the module interface.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a method for expanding low-capacity NAND flash chips into a high-capacity module. In the method, a CPLD chip and 2 to 16 low-capacity NAND flash chips are combined to form a high-capacity NAND flash expansion module; after being programmed by a user, the CPLD chip can be automatically switched among different flash chips; the type of the CPLD chip is LC4128V from Lattice company, and the CPLD chip is used for switching the control signals of the NAND flash chips, decoding addresses and improving drive capability at the same time; and under the module, blocks of all the chips are uniformly addressed, a program sends a command about the selection of one of the flash chips to the CPLD chip, the CPLD chip determines to switch the control signal of an NAND flash chip controller to a specific flash chip according to an input address wire, and a CPU performs read-write operation on the flash chip. The high-capacity NAND flash expansion module can be widely applied to intelligent devices, data acquisition terminals, and the field of data storage which has strict requirements on module space and power consumption.

Description

technical field [0001] The invention relates to a technical field applied to intelligent equipment and large-capacity data storage, in particular to a method for expanding a small-capacity NAND FLASH chip into a large-capacity module. Background technique [0002] With the development of technology, more and more electronic products need more intelligence, which also puts forward higher requirements for the storage of data and programs of these products. NAND FLASH chips are increasingly developing in the need for large-capacity data storage. NAND FLASH chips can be seen in almost all digital products, but for occasions that require large capacities, such as more than 20GB, single-chip NAND FLASH chips It cannot be done, or even if it can be done, it is either inconvenient for ordinary users to purchase, or the supply is unstable. However, for NAND FLASH chips below 4GB, it is relatively easy to purchase and the supply is relatively stable, so it is considered to expand the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F3/06G06F12/06
CPCY02B60/1225Y02D10/00
Inventor 邓昕岳梁华勇李伟
Owner 邓昕岳
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products