Gas delivery device and dry etching device
A technology of dry etching device and conveying device, which is applied in gas/liquid distribution and storage, electrical components, semiconductor/solid-state device manufacturing, etc. It can solve the problem of uneven distribution of etching line width and wafer process deviation that cannot meet the requirements and other issues to achieve the effect of improving consistency
Active Publication Date: 2010-12-22
SEMICON MFG INT (SHANGHAI) CORP +1
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It can be seen from the figure that the etching line width distribution is very uneven, and the gas delivery device in the prior art is used to supply the etching gas, and the process deviation between the edge and the center of the wafer cannot meet the requirements.
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[0025] The specific implementations of the gas delivery device and the dry etching device provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0026] Firstly, a schematic diagram of the structure of the gas delivery device of the present invention is given in conjunction with the accompanying drawings. Figure 5 Shown is a top view of the gas delivery device of this embodiment, with Image 6 Is attached Figure 5 Sectional view along the A-A direction. Attached Figure 5 Bottom view of the structure shown and attached image 3 There is no big difference, so it is omitted.
[0027] Reference attachment Figure 5 With attached Image 6 The gas delivery device 20 described in this specific embodiment includes a plurality of connecting pipes, which are represented by 231 to 236 here. In other specific embodiments, other numbers of connecting pipes may also be arranged. The multiple connecting pipes 231 to 236 are circular ri...
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The invention provides a gas delivery device. The device comprises a plurality of connecting pipes and a plurality of gas supply pipelines, wherein a plurality of connecting pipes are closed loops which are nested with one another in a plane, and each connecting pipe is provided with a plurality of gas nozzles; a plurality of gas supply pipelines are respectively connected to different connectingpipes, adjacent connecting pipes are connected with each other through an isolating valve which is used for controlling the state of connection and disconnection between the adjacent connecting pipes. The invention further provides a dry etching device. The devices has the advantages of being capable of adopting the isolating valve to adjust the output positions of gases, so that the interface positions of various gases which are introduced into a reacting chamber through different gas supply pipelines can be adjusted, and the coherence of an etching process can be better improved.
Description
【Technical Field】 [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a gas delivery device and a dry etching device. 【Background technique】 [0002] In the field of integrated circuit manufacturing, dry etching is a common etching process. Dry etching is to pass a specific etching gas into the surface of the sample in the reaction chamber. Under specific conditions, the substance on the surface of the same gas chemically reacts to achieve the purpose of etching. [0003] The gas used for etching is delivered to the reaction chamber by a special gas delivery device. In order to ensure that the gas used for etching can form a uniform and stable gas flow on the surface of the wafer to ensure the uniformity of the etching thickness and line width, the etching gas is usually divided into different gas paths and enters through the gas nozzle above the reaction chamber Reaction chamber. A common delivery method is to divide the etching gas i...
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IPC IPC(8): F17D1/04F17D3/01H01L21/00H01L21/3065
Inventor 王新鹏张海洋孙武
Owner SEMICON MFG INT (SHANGHAI) CORP