Opto-electric hybrid board and electronic device

A technology of photoelectric mixed substrate and electronic equipment, which is applied in branch equipment, optics, light guides, etc., can solve problems such as cracks and cracks, achieve good communication functions, good bending durability, and maintain communication functions.

Inactive Publication Date: 2010-12-29
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even with the above-mentioned form, when actually bending by the hinge, stress is applied to the optical waveguide portion, and as a result, the problem of cracks and cracks cannot be solved.

Method used

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  • Opto-electric hybrid board and electronic device
  • Opto-electric hybrid board and electronic device
  • Opto-electric hybrid board and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] (1-1) Production of optical waveguide film

[0100] [Production of resin film for cladding layer formation]

[0101]Weighing in a wide-mouth plastic bottle: phenoxy resin as (A) binder polymer (trade name: Finotote YP-70 (フエノト一トYP-70), manufactured by Tohto Chemical Co., Ltd.) 48 Parts by mass, 49.6 parts by mass of alicyclic diepoxycarboxylate (trade name: KRM-2110, molecular weight: 252, manufactured by Asahi Denka Co., Ltd.) as (B) photopolymerizable compound, as (C) photopolymerizable compound 2 parts by mass of triphenylsulfonium hexafluoroantimonate (trade name: SP-170, manufactured by Soden Chemical Industry Co., Ltd.) as a polymerization initiator, and SP-100 (trade name, manufactured by Soden Chemical Industry Co., Ltd.) as a sensitizer ) 0.4 parts by mass, 40 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent; use a mechanical stirrer, a shaft and a paddle, stir for 6 hours under the conditions of a temperature of 25°C and a rota...

Embodiment 2

[0124] In Example 1, a flexible electrical wiring board with a substrate thickness of 12.5 μm (length 120 mm, width 2 mm, base material Kapton 50EN (tensile strength: 380 MPa), copper circuit thickness : 12 μm). Except for this, it carried out similarly to Example 1, and produced the photoelectric hybrid board|substrate. Table 1 shows the results evaluated in the same manner as in Example 1.

Embodiment 3

[0126] In Example 2, except that the thickness of the reinforcing material was changed to 25 μm (“Kapton 100EN” manufactured by Toray DuPont Co., Ltd., tensile strength: 370 MPa), an opto-electric hybrid substrate was produced in the same manner as in Example 2. . Table 1 shows the results evaluated in the same manner as in Example 1.

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PUM

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Abstract

Provided is a flexible opto-electric hybrid board wherein an optical waveguide film, which has a core and a clad, and a flexible electric wiring board are bonded, and a reinforcing material is arranged at least at a part on the optical waveguide film side of a part to be bent. An electronic device using such flexible opto-electric hybrid board is also provided. The opto-electric hybrid board which does not break nor generate cracks even when bent or folded is provided by bonding the optical waveguide film and the flexible electric wiring board. The electronic device uses such opto-electric hybrid board.

Description

technical field [0001] The present invention relates to an opto-electric hybrid substrate combining flexible optical wiring and electric wiring, and an electronic device using the substrate. Background technique [0002] In recent years, in the aspect of high-speed and high-density signal transmission between electronic components and wiring boards, mutual interference and attenuation of signals have become obstacles in the transmission of conventional electrical wiring, and the trend of high-speed and high-density signals has begun to appear. limit. In order to solve this problem, research is under way to connect electronic components and wiring boards with light, so-called optical interconnection. As an optical transmission line, polymer optical waveguides have attracted attention from the viewpoint of ease of processing, low cost, high degree of freedom of wiring, and possibility of high density. [0003] In particular, the use of optical waveguides in mobile phones, no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/122H05K1/02
CPCH05K2201/2009G02B6/3612H04M1/0277H05K1/0274H04M1/0214G02B6/43H04M1/0235H05K1/0281G02B6/4281G02B6/4283
Inventor 黑田敏裕柴田智章八木成行
Owner HITACHI CHEM CO LTD
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