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Radiation device for LED lamp

A technology of LED lamps and heat sinks, which is applied to the cooling/heating devices of lighting devices, lighting devices, components of lighting devices, etc. problem, to achieve the effect of simple structure, prolong service life, and strengthen heat dissipation effect

Inactive Publication Date: 2011-01-05
魏展生
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat dissipation effect of this kind of radiator is not complete, especially for SMD LED lamps, it does not have a positive heat dissipation effect

Method used

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  • Radiation device for LED lamp
  • Radiation device for LED lamp
  • Radiation device for LED lamp

Examples

Experimental program
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Effect test

Embodiment Construction

[0022] The present invention is described in detail below in conjunction with accompanying drawing:

[0023] Such as Figures 1 to 6 The shown heat dissipation device for LED lamps includes a heat dissipation cylinder 1, the heat dissipation cylinder 1 is a copper cylinder, and a sealed convex portion 2 is provided on one end of the heat dissipation cylinder 1, The convex part 2 is arranged in the through hole 4 of the LED substrate 3, and the end surface of the convex part 2 can be welded together with the heat conduction plate 6 on the bottom surface of the LED lamp 5, and the electrode 7 of the LED lamp 5 is welded on the bottom surface of the LED lamp 5. On the substrate 3 described above, the substrate 3 is a PCB circuit board.

[0024] The first embodiment of the heat dissipation cylinder 1 in the present invention is as follows: Figure 4 As shown, a plurality of heat dissipation through holes 8 are provided on the heat dissipation cylinder 1 .

[0025] The second em...

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Abstract

The invention discloses a radiation device for an LED lamp, which is characterized by comprising a radiating barrel, wherein one end of the radiating barrel is provided with a sealing convex part which is arranged in a through hole in an LED substrate; the end face of the convex part can be welded with the bottom surface of the LED lamp; and the electrode of the LED lamp is welded on the substrate. The radiation device for the LED lamp is characterized in that the bottom surface of the LED lamp is provided with a heat-conducting plate which is welded with the convex part. The aim of the invention is to overcome the drawbacks of the prior art and provide a radiation device with a good radiation effect for both a high-power LED and a laminated LED lamp.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device for an LED lamp. 【Background technique】 [0002] Because LEDs generate a lot of heat when they work at rated power, if the heat cannot be dissipated in time, it will accelerate the light decay of LED lights and shorten their service life. Chinese patent 200620156493.9 discloses a heat dissipation device for high-power LED lamps, which includes a substrate, an LED lamp, and a heat dissipation plate. The substrate is provided with a through mounting hole, and the LED lamp is installed in the mounting hole, and the electrodes of the LED lamp are connected to the substrate. On the front, the heat conduction plate and heat dissipation plate of the LED light are in contact with each other to form direct heat conduction. The heat dissipation effect of this radiator is not thorough, especially for the SMD LED lamp, it does not have a positive heat dissipation effect. 【Content of invention】 [0003] The p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V19/00F21V29/00F21V17/00F21Y101/02F21V29/50F21V29/56F21V29/83F21V29/89
Inventor 魏展生
Owner 魏展生
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