Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate holder module and a substrate assembling device containing the same

A technology for holders and substrates, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the upper and lower substrates are not completely adhered to each other, have defects, etc.

Active Publication Date: 2011-01-05
AP SYST INC
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, however, there is a problem in that the upper and lower substrates are not completely adhered to each other and there is a somewhat separate space between the upper and lower substrates
At this time, the obtained device is defective since unnecessary gas is introduced through a separate space between the upper and lower substrates

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate holder module and a substrate assembling device containing the same
  • Substrate holder module and a substrate assembling device containing the same
  • Substrate holder module and a substrate assembling device containing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments as will be described hereinafter, but may be implemented in other various forms different from each other, and the embodiments of the present invention are provided only to complete the disclosure of the present invention and for those skilled in the art to fully understand. understand the scope of the invention. Throughout the drawings, the same reference numerals are used to designate the same elements.

[0016] Figure 1 to Figure 3 are cross-sectional views sequentially explaining a method of mounting upper and lower substrates by using the substrate mounting apparatus according to the embodiment of the present invention.

[0017] see Figure 1 to Figure 3 , the substrate mounting apparatus includes: a chamber 100 having an inner space; a substrate holder modul...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

According to the present invention, a substrate holder module includes an upper clamping disc having a nozzle for holding and fixing a substrate; a bypass unit communicated with the nozzle by a corresponding arrangement and capable of moving upwards and downwards; and a pressure adjusting unit connected to the bypass unit and including a integrated tube for changing the bypass unit and the nozzle to be a vacuum state or supplying gas to the bypass unit and the nozzle. The nozzle of the upper clamping disc is connected to the pressure adjusting unit having a discharging pump and a gas storage unit through the bypass unit. When upper and lower substrates are pasted with each other, the gas stored in the gas storage unit is injected into the top part of the upper substrate. Thus, the injection pressure of the gas ensures the upper substrate to be tightly pasted to the lower substrate. Thereby, when the inner portion of the chamber is at the atmospheric condition so as to fulfill the obtained adhesion, it is possible to prevent unwanted gas from guiding between the upper and lower substrates.

Description

technical field [0001] The present invention relates to a substrate holder module and a substrate mounting apparatus having the substrate holder module, and more particularly to a substrate holder module using gas injection pressure to adhere upper and lower substrates to each other and having The substrate mounting equipment of the substrate holder module. Background technique [0002] Conventionally, a cathode ray tube (CRT) has been used as a display device. However, the CRT has disadvantages in that it is bulky and heavy. Therefore, flat display panels such as liquid crystal displays (LCDs), plasma display panels (PDPs) and organic light emitting devices (OLEDs) have been increasingly used. The flat display panel described above is characterized by its light weight, thin thickness, and low power consumption. [0003] In the case of a flat display panel, a pair of upper and lower substrates are assembled to each other to manufacture a flat display panel. That is, for ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/50H01L21/683
Inventor 金容锡文成哲金光寿安成洙
Owner AP SYST INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More