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Manufacture method for buried capsulation structure of component and capsulation structure thereof

A technology of packaging structure and manufacturing method, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., and can solve problems such as long production cycle and low production process yield

Active Publication Date: 2011-01-05
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since electronic components usually have standard specifications and specific electrical characteristics, in order to accommodate electronic components with various electrical characteristics, the component embedded packaging structure must be customized, resulting in low manufacturing process yield and long production cycle

Method used

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  • Manufacture method for buried capsulation structure of component and capsulation structure thereof
  • Manufacture method for buried capsulation structure of component and capsulation structure thereof
  • Manufacture method for buried capsulation structure of component and capsulation structure thereof

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Embodiment Construction

[0076] The invention is described below with reference to the corresponding drawings, and embodiments of the invention are shown in the corresponding drawings. However, the present invention can be changed and applied in many different forms, so the following examples are not intended to limit the present invention. In fact, the following examples describe the present invention in a more detailed and complete manner, and fully convey the scope of the present invention to those skilled in the art. In the drawings, for special illustration, the size or relative size of each region and each layer may be shown in an enlarged manner.

[0077] In the present invention, terms such as "first", "second", and "third" are only used to distinguish various components, regions, layers and / or parts, and are not used to limit the components, regions, layers and / or parts. , but such members, regions, layers and / or sections should not be limited by these terms. These terms are only used to di...

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PUM

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Abstract

The invention discloses a manufacture method for a buried capsulation structure of a component and the capsulation structure thereof, wherein the method comprises the steps of: providing a plurality of preformed laminated structures, jointing or stacking the preformed laminated structures and assembling at least one electronic component on the jointing structure. The manufacture method can greatly enhance the production yield rate and shorten the production cycle.

Description

technical field [0001] The invention relates to a chip packaging structure and a manufacturing method thereof, and in particular to a manufacturing method of an element embedded packaging structure and the packaging structure thereof. Background technique [0002] In order to meet the trend of light weight and miniaturization of electronic products in the market, embedded package structure of components has become very common. However, since electronic components usually have standard specifications and specific electrical characteristics, in order to accommodate electronic components with various electrical characteristics, the component embedded packaging structure must be customized, resulting in low manufacturing process yield and long production cycle . [0003] In order to promote the development of this technology, it is necessary to simplify the fabrication of the component embedded packaging structure, so as to increase the yield of the fabrication process and redu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/48H01L23/498H01L23/13
CPCH01L2224/16225
Inventor 苏洹漳黄士辅博德·K·艾皮特李明锦
Owner ADVANCED SEMICON ENG INC