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Improved probe card for testing integrated circuits

A technology of integrated circuits and probe cards, applied in the direction of measuring electricity, measuring electrical variables, and components of electrical measuring instruments, can solve expensive and other problems

Inactive Publication Date: 2014-02-26
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0030] The disadvantage of the MEMS probe card is that even if only one MEMS probe is damaged, the entire multilayer ceramic head must be replaced and this is very expensive

Method used

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  • Improved probe card for testing integrated circuits
  • Improved probe card for testing integrated circuits
  • Improved probe card for testing integrated circuits

Examples

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Embodiment Construction

[0043] In the following description, the same reference numerals are used throughout to designate the same or similar elements in the drawings.

[0044] refer to figure 1 , schematically shows a cross-sectional view of the testing apparatus 100, wherein an exemplary structure and positioning of the probe card 105 and the semiconductor wafer 110 to be tested according to an embodiment of the invention can be seen.

[0045] A semiconductor wafer 110 to be tested is placed on a chuck 115, which is movable in three orthogonal directions "x", "y" and "z" indicated schematically in the figure. The chuck 115 can also be rotated and tilted, and it is capable of other movements, so that once the semiconductor wafer 110 is placed on the chuck 115, the latter moves so as to bring the die 145 of the wafer 110 to be tested close to the probe. Needle card 105, in order to realize its communication.

[0046] In the example in question, in one of the embodiments of the probe card 105, it in...

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PUM

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Abstract

An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.

Description

technical field [0001] Embodiments of the present invention relate to systems for testing integrated circuits (ICs), and in particular, they relate to probe cards for testing ICs. Background technique [0002] Many ICs are typically fabricated at a time in die form on a wafer of semiconductor material. After fabrication, the semiconductor wafer is divided so as to obtain a plurality of IC chips. [0003] Before being packaged and shipped to customers and installed in various electronic systems, ICs are tested in order to evaluate their functionality and in particular to ensure that they are not defective. In particular, during testing, (e.g., by examining the waveform of one or more output signals generated by the IC on each tested die) information about global or local physical faults, such as the presence of undesired shorts and breakdown event) and more generally information on the operation of the IC on each die under test so that only die meeting predetermined require...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/073
CPCB62M25/04G01R1/06727G01R1/07342G01R31/2889G01R1/0491
Inventor A·帕加尼
Owner STMICROELECTRONICS SRL