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Method for grafting maleic anhydride with bisphenol A epoxy resin free radicals

A technology of grafting maleic anhydride and epoxy resin, which is applied in the field of epoxy resin modification, and can solve the problems of reducing the excellent performance of epoxy resin

Inactive Publication Date: 2011-01-19
WUHAN INSTITUTE OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Usually, the chemical modification of epoxy resin is realized by the reaction of the epoxy group in the epoxy resin and the active group on the modifier, such as carboxyl group and amino group, which will inevitably reduce the amount of epoxy resin in the epoxy resin. The number of oxygen groups reduces the inherent good properties of epoxy resins

Method used

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  • Method for grafting maleic anhydride with bisphenol A epoxy resin free radicals
  • Method for grafting maleic anhydride with bisphenol A epoxy resin free radicals
  • Method for grafting maleic anhydride with bisphenol A epoxy resin free radicals

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Take 100g of E-20 type epoxy resin, add 75g of dioxane as solvent, heat to 50°C and stir to make the epoxy resin completely dissolved. Warm up to 90°C, add 30g maleic anhydride and 5g benzoyl peroxide, stir at constant temperature, maleic anhydride and benzoyl peroxide are added 3 times (there is no special requirement for each addition, the following examples are the same), The interval time is 3h. After the feeding is completed, the constant temperature reaction is continued for 3 hours, and the material is discharged to obtain the grafted product.

[0020] The graft product molecule contains both epoxy groups and anhydride groups with the following structure:

[0021]

[0022] The structure of the product was characterized by infrared spectroscopy, 1778.45cm -1 There is an obvious characteristic absorption peak of acid anhydride, indicating that maleic anhydride has been grafted onto the epoxy resin molecular chain; 915.46cm -1 And 831.04cm -1 It is the characteristic ab...

Embodiment 2

[0024] Take 100g of E-12 type epoxy resin, add 75g of dioxane as solvent, heat to 60°C, stir to make the epoxy resin completely dissolved. The temperature was raised to 90° C., 30 g maleic anhydride and 5 g benzoyl peroxide were added, and the mixture was stirred at constant temperature. Maleic anhydride and benzoyl peroxide were added in 3 portions with an interval of 3 hours. After the feeding is completed, the constant temperature reaction is continued for 3 hours, and the material is discharged to obtain the grafted product.

[0025] The graft product molecule contains both epoxy groups and anhydride groups with the following structure:

[0026]

[0027] The structure of the product was characterized by infrared spectroscopy, 1778.45cm -1 There is an obvious characteristic absorption peak of acid anhydride, indicating that maleic anhydride has been grafted onto the epoxy resin molecular chain; 915.46cm -1 And 831.04cm -1 It is the characteristic absorption peak of epoxy groups,...

Embodiment 3

[0029] Take 100g of E-10 type epoxy resin, add 75g of dioxane as a solvent, heat to 70°C and stir to completely dissolve the epoxy resin. The temperature was raised to 90° C., 30 g maleic anhydride and 5 g benzoyl peroxide were added, and the mixture was stirred at constant temperature. Maleic anhydride and benzoyl peroxide were added in 3 portions with an interval of 3 hours. After the feeding is completed, the constant temperature reaction is continued for 3 hours, and the material is discharged to obtain the grafted product.

[0030] The graft product molecule contains both epoxy groups and anhydride groups with the following structure:

[0031]

[0032] The structure of the product was characterized by infrared spectroscopy, 1778.45cm -1 There is an obvious characteristic absorption peak of acid anhydride, indicating that maleic anhydride has been grafted onto the epoxy resin molecular chain; 915.46cm -1 And 831.04cm -1 It is the characteristic absorption peak of epoxy groups, ...

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Abstract

The invention relates to a modification method of epoxy resins, in particular to a method for grafting maleic anhydride with bisphenol A epoxy resin free radicals, which is characterized in that the method comprises the following steps of 1) selecting raw materials according to the mass ratio of bisphenol A epoxy resin to dioxane solvent to maleic anhydride to free radical initiator of 100 to 75 to 30 to (3 to 6); 2) preheating the bisphenol A epoxy resin in the dioxane solvent to be fully dissolved; rising the temperature to 80 to 90 DEG C; adding the maleic anhydride and the free radical initiator for three times, wherein the interval time of each material addition is 3h; finishing the material addition; continuing a constant temperature reaction for 3h; and taking out the materials to prepare grafting products. The grafting products prepared by the method maintain basically unchangeable epoxide groups in original epoxy resin molecules and simultaneously have anhydride functional groups so that the reaction activity of the anhydride functional groups in the epoxy resin molecules is utilized to modify the epoxy resins.

Description

Technical field [0001] The invention relates to an epoxy resin modification method, in particular to a method for radically grafting maleic anhydride with bisphenol A epoxy resin. Background technique [0002] Epoxy resin is a widely used thermosetting resin with good electrical insulation, chemical stability, adhesion, processability and other characteristics, and is widely used in construction, machinery, electronics and electrical, aerospace and other fields. But simple epoxy resin also has some shortcomings. After curing, it has high cross-linking density, high internal stress, brittleness, poor impact resistance, crack resistance, weather resistance, and humidity resistance, so it is difficult to meet the requirements of engineering technology. In recent years, structural bonding materials, packaging materials, fiber reinforced materials, laminates, integrated circuits, etc. require epoxy resin materials to have better comprehensive properties, such as good toughness, low in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10
Inventor 官仕龙杨专吴畏匡启荣
Owner WUHAN INSTITUTE OF TECHNOLOGY
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