Effective heat-radiation LED lamp
An LED lamp and high-efficiency technology, applied in lighting and heating equipment, parts of lighting devices, cooling/heating devices of lighting devices, etc., can solve the problems of small surface area, affecting the service life of LED lamps, and unsatisfactory heat dissipation effect, etc. Achieve the effect of prolonging the service life, good heat dissipation effect and large heat dissipation area
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Embodiment 1
[0018] Embodiment 1: as figure 1 As shown, the heat sink for LED lamps includes a substrate 1 and multiple groups of heat dissipation components 2 fixed on the upper surface of the substrate 1 and distributed in a matrix. The substrate 1 is a solid metal plate, and each group of heat dissipation components 2 includes a support body 3 and a plurality of pieces The heat sink 4, the cross section of the support body 3 is circular, the support body 3 is vertically fixed on the upper surface of the substrate 1 through its lower end and forms a thermal connection with the substrate, and the multi-piece heat sink 4 is perpendicular to the upper surface of the substrate 1 and along the support The surface of the body 3 is radially distributed, the cooling fins 4 and the supporting body 3 are integrally formed and form a thermal connection with the supporting body, and heat dissipation channels 6 perpendicular to the upper surface of the substrate are formed between adjacent cooling fin...
Embodiment 2
[0019] Embodiment 2: as figure 2 As shown, the heat sink for LED lamps includes a substrate 1 and multiple groups of heat dissipation components 2 fixed on the upper surface of the substrate 1 and distributed in a matrix. The substrate 1 is a solid metal plate, and each group of heat dissipation components 2 includes a support body 3 and a plurality of pieces Radiating fins 4, the cross-section of the support body 3 is rectangular, the multi-piece cooling fins 4 are perpendicular to the upper surface of the substrate 1 and distributed on the opposite sides of the supporting body 3, the cooling fins 4 are parallel to each other, and the supporting body 3 passes through them. The lower end is vertically fixed on the upper surface of the substrate 1 and forms a thermal connection with the substrate. The heat sink 4 and the support body 3 form an integral structure and form a thermal connection with the support body. Adjacent heat sinks form a heat dissipation vertical to the uppe...
Embodiment 3
[0020] Embodiment 3: as figure 2 As shown, the heat sink for LED lamps includes a substrate 1 and multiple groups of heat dissipation components 2 fixed on the upper surface of the substrate 1 and distributed in a matrix. Each group of heat dissipation components 2 includes a support body 3 and a plurality of heat sinks 4. The cross-section is rectangular, and the plurality of cooling fins 4 are perpendicular to the upper surface of the substrate 1 and distributed on the opposite sides of the support body 3. The cooling fins 4 are parallel to each other, and the support body 3 is vertically fixed on the bottom of the substrate 1 through its lower end. The upper surface forms a heat conduction connection with the substrate, and the heat sink 4 and the support body 3 form an integral structure and forms a heat conduction connection with the support body. A heat dissipation channel 6 perpendicular to the upper surface of the substrate is formed between adjacent heat sink fins.
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