Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Inter-board communication method and virtual intermediate layer device

An information interaction and single-board technology, applied in the direction of data exchange network, digital transmission system, electrical components, etc., can solve the problem that key data cannot be synchronized

Inactive Publication Date: 2011-01-26
HANGZHOU DPTECH TECH
View PDF2 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a more effective inter-board communication mechanism to solve the bottleneck problem that some key data cannot be synchronized in the dual-machine hot backup in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Inter-board communication method and virtual intermediate layer device
  • Inter-board communication method and virtual intermediate layer device
  • Inter-board communication method and virtual intermediate layer device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In the traditional dual-system hot backup mechanism, the active main control board (also known as the Active main board) and the standby main control board (also called the Standby main board) can exchange a lot of data, such as routing entries and so on. However, these data can be implemented using traditional backup mechanisms. The present invention will focus on how to back up the data in the internal memory, such as the configuration of chips and modules. Of course, the present invention can be used together with traditional dual-system hot standby. The present invention mainly relates to the management plane. For related design of the service plane such as message forwarding, please refer to the prior art, and the present invention will not describe it in detail.

[0035] Basic hardware environment:

[0036] Please refer to figure 1 , as a preferred implementation manner, the frame-type device mentioned in the present invention includes an Active main board, a S...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an inter-board communication method, applied to single boards of frame type equipment. The method includes: the upper application instruction of a single board is sent to an opposite terminal single board by virtue of a hardware channel; the instruction sent by the opposite terminal single board is received from the hardware channel, and a hardware module on which the instruction is operated is determined according to the head of the instruction; then corresponding operation information is called and executed; operation result corresponding to the operation information which is returned by virtue of the hardware channel is received; and the operation result is returned to the opposite terminal single board by virtue of the hardware channel. The invention can effectively solve synchronization of key configuration data in hot standby mechanism and provides a more general inter-board communication mechanism.

Description

technical field [0001] The present invention relates to inter-board communication technology, in particular to an inter-board communication technology on frame equipment. Background technique [0002] Most of the large-scale network devices currently on the market are frame structures, also called distributed devices, which are usually composed of a main control board and a service board. This distributed device can seamlessly integrate high-capacity L2-L3 layer switching and rich 4-7 layer business processing. The business environment based on this hardware platform can flexibly expand a series of Ethernet switches, IPS, content auditing and Control, firewall (including application firewall), application acceleration, diversion, and blocking devices, etc. This large-scale hardware platform is often used in various important occasions, such as banking systems, telecommunications systems, university network systems, and industrial security systems. These users have high requ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04L1/22H04L12/24
Inventor 王涛李炳志秦永乐王伟威
Owner HANGZHOU DPTECH TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products