Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof

Abstract

The invention discloses a wash-free soldering flux for leadless low-temperature soldering paste, which comprises the following components in percentage by weight: 27 to 37 percent of modified abietic resin, 10 to 12 percent of thixotropic agent, 8 to 12 percent of tackifier, 10 to 12 percent of organic activator, 0.5 to 2.0 percent of lube and the balance of organic solvent. The invention also discloses a preparation method of the wash-free soldering flux for the leadless low-temperature soldering paste. The soldering flux in the invention can keep high application characteristics for a long time under the working conditions of an environmental temperature of less than or equal to 30 DEG C and humidity of more than or equal to 80 percent and is particularly suitable for preparing the low-temperature soldering paste from high Bi content-containing alloy systems such as Sn-58Bi, Sn-57Bi-1.0Ag, Sn-35Bi-1.0Ag.

Description

technical field [0001] The invention relates to a flux, in particular to a no-clean flux for lead-free low-temperature solder paste, and also relates to a preparation method of the no-clean flux for lead-free low-temperature solder paste. Background technique [0002] Lead-free solder paste is widely used in the production process of electrical and electronic products. Now the solder paste prepared by using SnAgCu, SnAg and other lead-free alloy solders, the reflow temperature is generally ≥ 240 ℃. However, the operating environment temperature of a large number of home appliances and communication electronic products is lower than 150°C. Therefore, the low-temperature solder paste prepared by low melting point and lead-free alloy solder has broad application prospects. [0003] At present, it is a strategically important policy for my country to expand domestic demand, develop the economy, and send home appliances and communication products to the countryside. Energy cons...

AI Technical Summary

Problems solved by technology

However, due to their low volatilization temperature and fast volatilization speed, the prepared low-temperature solder paste has fast deterioration in printing performance and short service life, and it is difficult to guarantee the accuracy and printing speed of continuous printing.

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