Press forged metal housing for leds and an led metal package using the metal housing
A metal shell and LED chip technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve problems such as uneven surfaces, difficulty in adding lead frame automation, and weakened brightness, and achieve the effect of reducing production costs
Inactive Publication Date: 2011-02-09
尹成老 +1
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Problems solved by technology
Therefore, it is difficult to automate the leadframing of the housing and use the leadframed housing to manufacture the LED package
[0009] In particular, the reflective surface of a conventional housing for LED molded using metal injection molding has a very uneven surface due to formation by bonding of metal particles, and thus cannot completely and purely reflect light emitted from the LED, while Are highly retroreflective or diffuse reflective, resulting in rapid loss of brightness
Method used
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[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0034] Figure 1 to Figure 9 A press-forged metal case 1 for LEDs and an LED metal package 1 - 1 using the press-forged metal case 1 for LEDs according to an embodiment of the present invention are shown.
[0035] Figure 1 to Figure 4 To show a perspective view, a plan view, a bottom view and a front view of a press-forged LED metal housing 1 according to an embodiment of the present invention; Figure 3 to Figure 4 d is a perspective view, a plan view, a bottom view and a side view showing an LED metal package 1 - 1 manufactured using the press-forged metal housing 1 for LEDs according to an embodiment of the present invention.
[0036] The press-forged LED metal case 1 according to the embodiment of the present invention is formed as follows.
[0037] As shown, the housing main body 10 formed in a rectangular shape (square shape) or a disk s...
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Disclosed are an LED (Light Emitting Diode) metal housing produced by press forging according to the present invention and an LED metal package using the metal housing, wherein the LED housing comprises a housing body having a chip mount part formed on a central portion of the top surface to receive one or more LED chips therein, and a reflective protrusion integrally formed outside the chip mount part on the top surface of the housing body, the integrated housing body and reflective protrusion being made out of a metallic material. By forming the housing body where one or more LED chips are mounted and the reflective protrusion from a metallic material, the present invention makes it possible to unify and standardize the volume (size) of LED housings. Advantages of standardized LED housings include automatic mounting of LED chips, automatic connection of electrode lines between LED chips and terminals, automatic mounting of an external terminal and an increase in automated operation rate of a series of resin (casting resin or silicon) coating processes. These result in an improved yield and reduced material costs. Moreover, the housing and reflective protrusion formed from a metallic material can not only increase the illuminance on a reflection surface and further the luminance of an optical element package, but also prevent luminance degradation and utilizes LED-generated light in an efficient way.
Description
technical field [0001] The present invention relates to a metal case made of a metal material by press forging and used for mounting a light emitting diode (LED) therein to make an LED package and an LED metal package using the metal case . [0002] More particularly, the present invention relates to a metal case for LEDs and a press-forged LED metal package formed using the same, the metal case for LEDs comprising: a case body having an upper surface formed on the case body a chip base in the middle part of the middle part, and more than one LED is installed therein; and a reflective protrusion, which is integrally formed with the housing main body around the chip base on the upper surface of the housing main body, wherein the housing main body and the reflective protrusion are made of metal material become. Background technique [0003] As we all know, LED is a device that utilizes the phenomenon of emitting light when current flows in the forward direction through the P...
Claims
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IPC IPC(8): H01L33/60H01L33/00H01L33/48H01L33/64
CPCH01L2924/0002H01L25/0753H01L33/486H01L33/641H01L33/60H01L2924/00
Inventor 尹成老金敏功
Owner 尹成老