Punching molding mold of integrated circuit product

Abstract

The invention discloses a punching molding mold of an integrated circuit product, which comprises a molding and pressing block, a molding punch, a molding concave die and a cutting concave die, wherein a rotating shaft (4) is arranged longitudinally in the middle of the molding punch (3) and is axially and movably fixed; and the molding punch (3) and a molding cam (1) are matched so that the molding punch (3) and a strip touching end (8) do curvilinear motion. In the structure, the contact area between the molding punch and a strip is small; the touching end does curvilinear motion along with the bending molding of pins; the friction between the molding punch and the strip is reduced; and thus, tin scraping of a pin molding area is largely reduced and the span of the pins and the height consistency among the pins are maintained. The molding concave die is further improved and comprises a concave die (6) and a concave die (7) which are combined, and thereby the tin scraping of the pin molding area is further reduced.

Description

technical field [0001] The invention relates to a stamping die for an integrated circuit product, which comprises a forming pressing block, a forming punch, a forming die and a cutting die. Background technique [0002] The punching dies for integrated circuit products produced by the applicant in the early stage include forming compact blocks, forming punches, forming dies and cutting dies. When forming, the upper mold goes down and the forming compression block first presses the strip on the forming die, then the upper mold continues to descend, and the forming punch touches the strip until it interacts with the cutting die to cut the strip, and then continues to descend Bending the product to the predetermined size and shape to complete the molding work. However, since the colloidal thickness of the current packaged products is getting thinner and thinner, the requirements on the appearance and size of the pins are becoming more and more stringent. Using the aforementio...

AI Technical Summary

Problems solved by technology

However, due to the thickness of the colloid of the current packaging products is getting thinner and thinner, the requirements for the appearance and size of the pins are becoming more and more stringent.

Using the aforementioned punching and forming dies for punching and forming often results in severe tin scraping in the forming area of ​​the pins of the product, as well as large differences in the span of the pins and the height of the pins, which affects the performance and quality of the product and cannot meet the market requirements. development needs

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