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一种透明衬底、衬底的技术，应用在制造这种晶片尺度封装,晶片尺度封装,制造多个光学元件领域，能够解决杂散光采集、设计可能性限制、对准困难等问题，达到简化光学设计、简化制造和处理、节省空间的效果

Active Publication Date: 2017-05-17
HEPTAGON MICRO OPTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Alignment in the second step is particularly difficult because structures are already present on other surfaces
This limits the design possibilities and can also lead to unwanted stray light being collected into the device

Method used

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Examples

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Embodiment Construction

[0057] figure 1A purely schematic representation of a wafer-scale package 10 according to the invention with two flat outer substrates 20, 30 (preferably standard wafers) and a plurality of cavities 40 between the substrates 20, 30 the embodiment. The outer substrates 20 , 30 are stacked along a direction z (also called axial direction) orthogonal to their main surfaces 22 , 24 , 32 , 34 . The substrates 20 , 30 are axially separated by spacer block means 50 .

[0058] The axial walls 42, 44 of the cavity 40 (i.e. figure 1 The walls of the bottom and top) are formed by portions of the inner surfaces 24, 34 of the two outer substrates 20, 30. The lateral walls 46 , 48 of the cavity 40 are formed by corresponding lateral walls 54 of the spacer block arrangement 50 . The spacer arrangement 50 consists of, for example, a flat substrate with a plurality of through holes (spacer matrix) or a separate spacer.

[0059] Optical elements 62, 64 are attached to the inner surfaces ...

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Abstract

The invention relates to a wafer scale package comprising two or more axially stacked substrates (20, 30) (wafers) and a plurality of replicated optical elements (62, 64). The invention also relates to an optical device (100) comprising one or more optical elements, and to a method of manufacturing such a wafer-scale package. Wafer-scale packages and devices contain one or more cavities that accommodate optical elements, while the end faces of the package or device are flat and contain no replicated optical elements thereon. The invention allows a reduction in the number of double-sided substrates and has advantages in the design and manufacture of optical devices.

Description

technical field [0001] The invention belongs to the field of manufacturing integrated optical devices with two or more optical elements (eg refractive and / or diffractive lenses) in a precisely defined spatial layout on the wafer scale by means of a replication process. Such integrated optics are, for example, camera devices, optics for camera devices or collimating optics for flashlights, which are used in particular in camera mobile phones. More specifically, the present invention relates to wafer-scale packages comprising two or more substrates (wafers) stacked in the axial direction and having multiple replicated optical elements. The invention further relates to an optical arrangement (such as a camera or corresponding collimation optics) comprising two or more replicated optical elements and optionally also an electro-optical unit, the invention relates to the fabrication of such wafer-scale A method of encapsulating, and relating to a method of fabricating a plurality o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H04N25/00
CPCG02B3/0062G02B7/02H01L27/14627H01L27/14685H01L2924/16235B29D11/00307H04N23/57
Inventor M·罗西H·鲁德曼V·凯图南
Owner HEPTAGON MICRO OPTICS