253results about How to "Strong coupling" patented technology

A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.

A system for communicating information, particular for use in a hydrocarbon well, is described including one or more releasable vessels having radio frequency (RF) circuitry responsive, when in use, to an RF reader system, the vessel including counteracting means to reduce the effect of destabilizing flow forces thereby extending the coupling time with the reader system.

The invention relates to a global optimization method of an ultra-low emission multi-pollutant cooperative removal system, which obtains an accurate description of a multi-pollutant generation, migration, conversion and removal process in a multi-device through an accurate modeling of a multi-device multi-pollutant cooperative removal process in an ultra-low emission system. The multi-pollutant emission reduction cost under different load, coal quality, pollutant concentration and operation parameters is evaluated accurately by the global operation cost evaluation method in ultra-low emissionsystem. Minute-level planning and optimization of emission reduction of global pollution reduction devices under different emission targets are realized by global operation optimization method of multi-pollutant multi-objective and multi-operating conditions. Reliable emission reduction and side-by-side control of pollutants are ensured through advanced control methods with low emission and multi-pollutant emission meeting the standards reliably. The invention innovates the modeling, optimization and control method of the ultra-low emission system from the aspects of model, architecture and algorithm, improves the controllability and adjustability of the system, and guides the efficient, reliable and economic operation of the ultra-low emission system.

A delay line structure disposed on a substrate having a dielectric base layer formed with a via, a layout layer and a grounding layer with a grounding circuit, includes two parallel spiral delay lines having a first outer straight section, a first outer bent section, an inner spiral region, a second outer bent section and a second outer straight section. The inner spiral region bends reciprocally between the first and second outer straight sections to form several inner bent parts and several inner straight parts. A grounding guard trace is disposed among the first and second outer straight sections and the inner straight parts and is coupled electrically to the grounding circuit, wherein each of the first and second outer bent sections and the inner bent parts has a width smaller than each of the first and second outer straight sections and the inner straight parts.

A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.