Matrix MOV circuit board structure and manufacturing method thereof

Abstract

The invention discloses a matrix metal oxide varistor circuit board structure and a manufacturing method thereof. The structure comprises a printed circuit board (PCB), a copper conductive busbar, and a plastic module comprising the metal oxide varistor, a thermal fuse body and a sampling resistor, wherein the copper conductive busbar is attached to a copper foil of the PCB; the copper conductive busbar is integrated with an electrode used for connecting a dual-port wiring terminal into a whole and is provided with an element pin welding hole which is synchronous with the PCB; and the plastic module comprising the metal oxide varistor, the thermal fuse body and the sampling resisto is directly welded on the conductive busbar. In the circuit board structure, the integrally punched copper conductive busbar is adopted and attached to the copper foil of the PCB, the sectional area of a lead of the circuit board is increased, and the contact resistance is reduced. Therefore, the capacity of the circuit board of bearing heavy current is improved, and the equalized current between the matrix distribution metal oxide varistor, and the plastic module comprising the thermal fuse body and the sampling resistor is realized.

Description

technical field [0001] The invention relates to a PCB copper foil current expansion technology and a matrix metal oxide varistor current sharing technology in the field of lightning protection, in particular to a circuit board structure of a matrix metal oxide varistor and a manufacturing method thereof. Background technique [0002] The design of PCB printed circuit boards in lightning protection products is widely used at home and abroad, but it is limited by the thickness of the copper foil of the PCB board, so that when the lightning protection product passes a relatively large impact current, such as above 100kA, the copper foil of the PCB board will be damaged. Melted by the instantaneous high current, causing the copper foil to vaporize, making the SPD invalid. [0003] The industry also adopts remedial measures to weld (tin solder) copper wires on the surface of copper foil in order to expand the current carrying capacity. However, in fact, this method cannot perfec...

AI Technical Summary

Problems solved by technology

However, when matrix metal oxide varistors are applied to lightning protection products, how to solve the creepage gap problem of matrix distributed metal oxide varistors, and how to better make metal oxide varistors The shunt of the lightning current is balanced, and the heat diffusion caused by the impact of the lightning current on the metal oxide varistor in time has also become a technical problem to be solved urgently in the industry.

Images