The invention discloses a wide bandgap semiconductor double-sided heat dissipation module packaging structure based on a conductive metal band, semiconductor power chips of different bridge arms are arranged on different power substrates, the size of a module is reduced, and the power density of the module is greatly improved; the power gasket is arranged between the top power substrate and the bottom power substrate, plays a role in mechanical support and electrical connection, provides an additional heat dissipation path for each semiconductor power chip on the basis of double-sided heat dissipation, reduces the thermal coupling degree between the chips, achieves the chip temperature equalization effect, and improves the heat dissipation environment of the chips; the driving loop and the commutation loop are nearly vertical in space, the electromagnetic coupling degree between the loops is greatly reduced, and the reliability of the module is further improved; the commutation loop uses the conductive metal belt to complete electrical connection required by the chip, the parasitic inductance value of the module is greatly reduced, and the source electrode conductive metal belt is provided with a hole groove at the joint, so that the distribution uniformity of the parasitic inductance can be improved, and the current sharing effect of the chip is achieved.