Power module, converter and wind generating set

A technology for power modules and converters, which is applied to conversion devices and circuits that convert AC power input into DC power output and output power, can solve the problems affecting the current sharing effect, the difficulty of designing AC bus circuits, and paralleling power semiconductor devices. Inconsistent temperature, etc., to achieve the effect of confluence and current sharing

Active Publication Date: 2017-12-01
BEIJING ETECHWIN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the parallel connection technology of power semiconductor devices, the semiconductor devices that need to be connected in parallel are generally placed on the same heat sink, and the symmetrical AC and DC circuit design is used to ensure current s

Method used

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  • Power module, converter and wind generating set
  • Power module, converter and wind generating set
  • Power module, converter and wind generating set

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] figure 1 Schematic diagram of the power module structure provided by the embodiment of the present invention Figure 1 ,Such as figure 1 As shown, the power module includes: a double-sided radiator 110, and two IGBT modules 120 with the same structure are symmetrically arranged on the front and rear heat dissipation substrates 111 of the double-sided radiator 110;

[0030] Two DC positive and negative laminated busbars 130 with the same structure are symmetrically arranged on the upper ends of the front and rear heat dissipation substrates 111 of the double-sided radiator 110, and each DC positive and negative laminated busbar 130 is connected to the same heat dissipation substrate 111. The DC input terminal of the IGBT module 120 is connected; the confluence position of the two DC positive and negative laminated busbars 130 is set on the side of the double-sided radiator 110;

[0031] The front and rear heat dissipation substrates 111 and the lower ends of the sides ...

Embodiment 2

[0044] Based on the power module described in the above embodiments, Figure 4 to Figure 7 The structure of the above-mentioned AC laminated busbar will be described in detail, where Figure 4 The schematic diagram of the structure of the AC laminated busbar provided by the embodiment of the present invention is to describe the structure of the AC laminated busbar 140 as a whole. Figure 5 , Figure 6 and Figure 7 are respectively for Figure 4 The structure of each AC busbar contained in .

[0045] First, if Figure 4 As shown, in order to ensure that the impedance parameters corresponding to the structure between the confluence position of each AC busbar in the AC laminated busbar 140 and the position used to connect the two AC output ends are equal, when designing the structure of the AC busbar, it may be There are two situations:

[0046] In the first type, the distance from the confluence position of the AC busbar to the position used to connect the two AC output t...

Embodiment 3

[0058] In this embodiment, the structure of the AC laminated busbar 140 will be described in detail according to the specific circuit structure constituting the IGBT module. As mentioned above, in the power module, the IGBT module 120 may be any one of a three-phase full-bridge circuit structure, an H-bridge circuit structure or a single-phase circuit structure including IGBT power devices.

[0059] Specifically, when the IGBT module 120 is a three-phase full-bridge circuit structure including IGBT power devices, the structure of the AC laminated busbar may specifically be a laminated busbar structure including three AC busbars, wherein:

[0060] The distance between the confluence position of one AC busbar in the AC laminated busbar and the position used to connect the two AC output terminals is the same, and the structure between the confluence position of the AC busbar and the position of the two AC output terminals is the same and symmetrical ;

[0061] The distances from...

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PUM

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Abstract

The embodiment of the invention provides a power module, a converter and a wind generating set. The power module comprises a double-sided radiator and two IGBT modules which have the same structure and are symmetrically arranged on a front heat-dissipating substrate and a rear heat-dissipating substrate of the double-sided radiator, and is characterized in that the upper end parts of the heat-dissipating substrates are symmetrically provided with two DC positive and negative laminated busbars with the same structure, and each DC positive and negative laminated busbar is connected with a direct-current input terminal of the IGBT module on the same heat-dissipating substrate; convergence parts of the two DC positive and negative laminated busbars are arranged at the side surface of the double-sided radiator; the front heat-dissipating substrate, the rear heat-dissipating substrate and the lower end part of the side surface are provided with AC laminated busbars, and the AC laminated busbars are respectively connected with alternating-current output terminals of the power module; convergence parts of the AC laminated busbars are arranged at the side surface of the double-sided radiator, and impedance parameters corresponding to the structures between the convergence part of each AC busbar in the AC laminated busbars and the part used for connecting two alternating-current output terminals are equal. The scheme provided by the invention can realize convergence and current sharing of the power module.

Description

technical field [0001] The invention relates to the technical field of wind power, in particular to a power module, a converter and a wind power generating set. Background technique [0002] With the continuous improvement of the output capacity of the converter, at present, power semiconductor devices are generally connected in parallel to form a power module with high power density. In the parallel connection technology of power semiconductor devices, the semiconductor devices that need to be connected in parallel are generally placed on the same radiator, and the symmetrical AC and DC circuit design is used to ensure current sharing, but the parallel connection of power semiconductors will cause the cooling air of the radiator to be insufficient If the double-sided radiator is used, although it can solve the problem of poor current sharing caused by different heat dissipation conditions, it will also cause the AC confluence circuit design Difficulty, increased system hea...

Claims

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Application Information

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IPC IPC(8): H02M7/00H01L23/49
CPCH01L23/49H02M7/003
Inventor 符松格贾超峰马刚
Owner BEIJING ETECHWIN ELECTRIC
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