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Method and apparatus for separating protective tape

A stripping device and protective tape technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of wafer reinforcement that cannot be reduced in rigidity, easily broken wafers, damaged wafers, etc.

Inactive Publication Date: 2011-04-06
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case the wafer will be damaged
[0007] Also, even if the wafer is adhered and held by the dicing tape, the reinforcement of the dicing tape alone cannot sufficiently reinforce the reduced rigidity of the wafer for the thinned wafer
Therefore, there is a new problem that the wafer is easily damaged during the process of transporting the mounting frame to the dicing process.

Method used

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  • Method and apparatus for separating protective tape
  • Method and apparatus for separating protective tape
  • Method and apparatus for separating protective tape

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Embodiment Construction

[0052] Next, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0053] In this embodiment, a semiconductor wafer is exemplified as a substrate. like figure 1As shown in the figure, the semiconductor wafer W (hereinafter simply referred to as "wafer W") is subjected to back grinding and dicing in a state where a protective tape PT for protecting circuit patterns on the wafer is pasted, thereby The wafer is divided into chip elements CP. The plurality of chip components CP are adhered and held on the ring frame f by an adhesive tape DT (dicing tape), and are used as a mounting frame MF.

[0054] Here, the protective tape PT includes a thermally foamable adhesive layer that expands and expands when the tape base material is heated and loses its adhesive force.

[0055] exist figure 2 and image 3 The schematic structure of the protective tape peeling apparatus which implements this invention and the process of peeling a p...

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PUM

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Abstract

The invention provides a method and an apparatus for separating a protective tape. A chuck table adhesively holds a rear face of a mount frame subject to a dicing process with a protective tape joined thereto, and a suction plate having a heater embedded therein contacts and heats the protective tape. Consequently, an adhesion layer of the protective tape reduces its adhesive force due to foaming and expansion. Thereafter, the suction plate moves upward while keeping its suction force to separate the protective tape from all of chips.

Description

technical field [0001] The present invention relates to a protective tape peeling method and apparatus for peeling off a protective tape for protecting semiconductor wafers, circuit substrates, and electronic devices (eg, LED (Light-emitting diode) or CCD (charge coupled device)) The circuit surface of the board|substrate, etc., especially relates to the technique of peeling a protective tape from the chip element obtained by dividing a board|substrate into predetermined shape. Background technique [0002] After many elements are formed on the surface of a semiconductor wafer (hereinafter simply referred to as "wafer"), the back surface of the wafer is ground in a back grinding process. Subsequently, the wafer is diced into components in a dicing process. In recent years, along with the demand for high-density mounting, wafer thicknesses tend to be kept at 100 μm to 50 μm or even thinner. [0003] Therefore, when thinning the wafer in the back grinding process, in order t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/67
CPCH01L21/67132Y10T156/1917Y10T156/1911Y10T156/1153Y10T156/1158Y10T156/1147H01L21/6835
Inventor 长谷幸敏山本雅之
Owner NITTO DENKO CORP