Testing system of special packaged chip
A test system and a technology for installing chips, which are applied in the direction of electronic circuit test, signal transmission system, electric signal transmission system, etc., can solve the problems that the test results cannot be directly displayed, take a long time, and are inconvenient to operate, so as to save switching Control interface, save operation time, use intuitive effects
Inactive Publication Date: 2011-04-13
SINO IC TECH
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Problems solved by technology
[0003] 1. Inconvenient operation, low efficiency, and error-prone. For different types of testing machines, different control interfaces need to be used to control the testing machine. Therefore, the control interface of the control center that is suitable for the testing machine model must be selected first when testing. , for unskilled testers, it takes a lot of time to find out the correct control interface, and it is error-prone;
[0004] 2. The test results cannot be directly displayed. There are usually tens of thousands of test data transmitted by the testing machine to the control center. To obtain the final test results (whether the sample to be tested is qualified and where it fails), it is necessary to analyze the tens of thousands of data.
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[0020] The following will combine Figure 1 ~ Figure 4 The test system for special packaged chips of the present invention is further described in detail.
[0021] see figure 1 , the test system of the special packaged chip of the present invention comprises a test box 100, a control center 200 and a test machine 300;
[0022] The control center 200 is bidirectionally connected to the testing machine 300;
[0023] The test box 100 is bidirectionally connected with the control center 200;
[0024] The test box 100 sends an operation instruction to the control center 200, and the control center 200 controls the test machine 300 to complete corresponding actions according to the operation instruction;
[0025] The test data measured by the testing machine 300 is transmitted to the test box 100 through the control center 200, and the test box 100 directly displays the test results after data analysis.
[0026] The test system for special packaged chips of the present invention...
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The invention provides a testing system of a special packaged chip. The testing system comprises a testing machine, a control center bidirectionally connected with the testing machine, and a testing case, wherein the testing case is bidirectionally connected with the control center; the testing case transmits operational instructions to the control center, and the control center controls the testing machine to finish corresponding actions according to the operational instructions; test data tested by the testing machine is transmitted to the testing case through the control center, and the test result is displayed after the data analysis is carried out by the testing case. The testing system of the special packaged chip is convenient to use and high in work efficiency, and can display the test result directly.
Description
technical field [0001] The invention relates to the field of integrated circuit testing, in particular to a testing system for special packaged chips. Background technique [0002] Some special-purpose integrated circuit products (such as military integrated circuits) do not match the manipulators (handler) in the existing test system. Since there are not many opportunities to test these special-purpose integrated circuit products, it is specially designed for these special-purpose integrated circuit products. It is uneconomical to configure matching manipulators. Therefore, the method used in the prior art to test these special-purpose integrated circuit products is to connect the sample to be tested with the testing machine, and manually control the testing machine through the control center connected to the testing machine. The disadvantages of this method for testing the sample to be tested are: [0003] 1. Inconvenient operation, low efficiency, and error-prone. For di...
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IPC IPC(8): G01R31/28G08C19/00
Inventor 凌俭波祁建华余琨赵达君刘远华陈燕王锦季海英
Owner SINO IC TECH