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Method for controlling machine sampling rate in semiconductor manufacturing process line

A manufacturing process and sampling rate technology, which is applied in the field of machine sampling rate control and adjustment, can solve problems such as the decline in yield rate, and achieve the effect of improving yield rate and preventing influence

Inactive Publication Date: 2012-10-31
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, historically constant sampling rates were insufficient to detect such abnormal fluctuations in product quality in a timely manner
As a result, the machine will continue to work for a certain period of time when the machine has already experienced abnormal conditions, resulting in a significant drop in the yield rate

Method used

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  • Method for controlling machine sampling rate in semiconductor manufacturing process line
  • Method for controlling machine sampling rate in semiconductor manufacturing process line
  • Method for controlling machine sampling rate in semiconductor manufacturing process line

Examples

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Embodiment Construction

[0015] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0016] refer to figure 1 , is a flowchart of an intelligent sampling rate control method especially for machine maintenance and repair according to an embodiment of the present invention.

[0017] In step 110, a key machine list is defined first. These critical tools are tools that have a significant impact on the quality of semiconductor wafers produced in the process line. The production of semiconductor wafers includes multiple process steps such as substrate material processing, initial oxidation, photolithography, etching, diffusion, deposition, annealin...

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Abstract

The invention discloses a method for controlling a machine sampling rate in a semiconductor manufacturing process line, comprising the following steps of: a, defining a key machine list; b, scanning one or a plurality of machines in the process line, and extracting the information of the machine; c, judging whether the machine scanned in the step b is in the key machine list and meets detecting conditions or not; d, defining an alarm message to the machine which is in the key machine list and meets the detecting conditions, wherein the alarm message comprises a target sampling rate of the machine; e, according to the alarm message, changing the original sampling rate of the machine into the target sampling rate; and f, automatically restoring the target sampling rate of the machine to theoriginal sampling rate after the period of validity of the target sampling rate. The method can control and adjust the machine sampling rate of the semiconductor manufacturing process line so as to effectively detect the work condition of the machine and improve the yield.

Description

technical field [0001] The invention relates to the quality control of the semiconductor manufacturing process, in particular to a method for controlling and adjusting the sampling rate of a machine in a process line. Background technique [0002] The manufacture of semiconductor products is completed from the initial wafer to the final processing to form a product, which needs to be completed through multiple steps on the entire process line. These steps include substrate material processing, oxidation, photolithography, etching, diffusion, deposition, cleaning, packaging, etc., and each step is usually completed on a different machine. In this process, in order to control the product quality at each stage of the process line, that is, the product yield rate, the products processed by different process steps are usually sampled and inspected. The number of samples collected per unit of time is called the sampling rate. In a certain period of time or in a certain amount of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418G05B21/02
CPCY02P90/02Y02P90/80
Inventor 黄辉
Owner SEMICON MFG INT (SHANGHAI) CORP
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