Improved triode lead frame
A technology of lead frame and triode, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of chip corrosion, chip failure and scrapping, etc., and achieve the effect of simple structure
Inactive Publication Date: 2012-02-01
吴江恒源金属制品有限公司
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Problems solved by technology
[0002]The plastic-encapsulated triode will produce flash and gel coat. Now most of them use acid solution soaking and washing to remove the flash and gel coat. However, the existing triode Due to the structure of the lead frame, a small amount of acid solution will immerse into the interior of the plastic package and corrode the chip during the acid solution soaking and scouring process, causing the corroded chip to fail and be scrapped in a short period of time
Method used
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[0013] The technical scheme of the present invention is described in detail below in conjunction with the embodiment shown in the accompanying drawings:
[0014] as attached figure 1 , attached figure 2 and attached image 3 As shown, the improved triode lead frame in the present invention includes several frame units, and the adjacent frame units are connected by the middle rib 1 and the bottom rib 2, and each frame unit includes a chip area 3, a The heat dissipation area 4, the left and right edges of the chip area 3 and the heat dissipation area 4 respectively extend a convex edge vertically to the side where the chip is positioned, a circular through hole 5 is arranged between the chip area 3 and the heat dissipation area 4, and the bottom of the chip area 3 The middle part extends downward to form the middle pin 6, and the left and right sides of the middle pin 6 are respectively provided with side pins 7, and the ends of the middle pin 6 and the two side pins 7...
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The invention discloses an improved triode lead frame which comprises a plurality of frame units, wherein the adjacent frame units are connected by middle ribs and bottom ribs; each frame unit comprises a chip area and a radiating area positioned above the chip area; a round through hole is arranged between each chip area and each radiating area; the middle part below the chip area extends downward to form a middle pin; side pins are arranged on the left side and the right side of the middle pin; each middle rib extends between the middle pin and the two side pins; each bottom rib extends between the middle pin and the two side pins; a square chip positioning area is arranged in the chip area; and a first V groove and a second V groove are arranged between the round through hole and the chip positioning area. The improved triode lead frame has the advantages of simple structure and no need of any additional components, and is suitable for popularization and use in the industry field.
Description
technical field [0001] The invention relates to a lead frame, in particular to a triode lead frame provided with two V-shaped grooves above the chip positioning area. Background technique [0002] The plastic-encapsulated triode will produce flash and gel coat. Now most of the production process is to remove the flash and gel coat by soaking and washing in acid solution. However, the structure of the existing triode lead frame will have a small amount of damage during the process of soaking and washing in acid solution. The acid solution immerses into the inside of the plastic package to corrode the chip, causing the corroded chip to fail and be scrapped within a relatively short period of time. Contents of the invention [0003] The purpose of the present invention is to provide a triode lead frame with two V-shaped grooves above the chip positioning area, which can effectively prevent acid liquid from corroding the chip. [0004] In order to solve the problems of the te...
Claims
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IPC IPC(8): H01L23/495
Inventor 陆丽强钟俊东
Owner 吴江恒源金属制品有限公司