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Lead frame for transistor

A lead frame and triode technology, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of chip corrosion, chip failure and scrap, and achieve the effect of preventing chip corrosion and simple structure.

Inactive Publication Date: 2012-03-07
张轩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The function of the lead frame is very important. After the chip is packaged, the triode will produce flash and gel coat. Now most of them use the production process of acid solution soaking and washing to remove the flash and gel coat. However, the existing triode lead frame structure, in the process of soaking and rinsing in acid solution, a small amount of acid solution will immerse into the interior of the plastic package and corrode the chip, causing the corroded chip to fail and be scrapped in a short time

Method used

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  • Lead frame for transistor
  • Lead frame for transistor
  • Lead frame for transistor

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Embodiment Construction

[0014] The technical scheme of the present invention is described in detail below in conjunction with the embodiment shown in the accompanying drawings:

[0015] Please see attached figure 1 , attached figure 2 and attached image 3 As shown, a lead frame for a triode of the present invention includes several frame units, and adjacent frame units are connected by upper ribs 4, middle ribs 5 and bottom ribs 6, and the upper ribs of adjacent frame units are connected 4 is provided with a waist-shaped hole, which can facilitate the cutting of the lead frame. Each frame unit includes a heat dissipation area 1, a chip area 2 and a pin area 3. The heat dissipation area 1 is located directly above the chip area 2. A A circular through hole 11 , the pin area 3 is located directly below the chip area 2 .

[0016] Wherein, a chip positioning area 21 is arranged in the chip area 2 , a U-shaped groove I 22 is arranged around the chip positioning area 21 , and a U-shaped groove II 23 i...

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PUM

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Abstract

The invention relates to a lead frame for a transistor. The lead frame comprises a plurality of frame units, wherein the adjacent frame units are connected by upper ribs, middle ribs and bottom ribs; kidney holes are formed in the upper ribs connecting the adjacent frame units; each frame unit comprises a radiating area, a chip area and a pin area; the radiating area is arranged right above the chip area; a circular through hole is formed in the radiating area; and the pin area is arranged right below the chip area. The lead frame for a transistor has a simple structure, dispenses with any additional part for separation and can effectively prevent acid liquor from eroding the chip.

Description

technical field [0001] The invention relates to a semiconductor element, in particular to a lead frame for a triode. Background technique [0002] With the development of the electronic market, the integration of semiconductor devices is getting higher and higher, and its storage capacity, signal processing speed and power are increasing rapidly, but the volume is getting smaller and smaller. This trend has accelerated the development of semiconductor device packaging technology, so the importance of semiconductor device packaging technology has attracted the attention of manufacturers. The high integration of semiconductor devices and the increase of memory also lead to a corresponding increase in the number of input and output terminals, which in turn leads to a corresponding increase in the number of leads, which requires that the layout of the leads must also be fine. [0003] The lead frame is the skeleton in the semiconductor package, which is mainly composed of three...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L2924/0002
Inventor 张轩
Owner 张轩