A trench substrate and a fabricating method the same
A groove and substrate technology, which is applied in the directions of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of undesired formation of grooves 16, uneven shape of grooves 16, and difficulty in controlling the depth d of grooves 16.
Inactive Publication Date: 2011-05-04
SAMSUNG ELECTRO MECHANICS CO LTD
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[0009] However, in the case of processing the groove 16 on the insulating layer 12 made of the same material as a conventional technique, it is not easy to control the depth d of the groove 16, and the grooves 16 having different depths d are undesirably formed.
In the case where the grooves 16 have different depths d, their width w will vary, so that the grooves 16 may have an uneven shape, and thus the negative pattern 18 formed in the grooves 16 will inevitably have non-uniform shape
Therefore, it is difficult to form a fine and uniform circuit pattern
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[0039] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. Throughout the drawings, the same reference numerals are used to designate the same or similar elements. Furthermore, even if descriptions of known techniques are related to the present invention, as long as they make the features of the present invention unclear or render the description unclear, they are considered unnecessary and may be omitted.
[0040] Furthermore, the terms and words used in this specification and claims should not be construed as being limited to their ordinary meanings or dictionary definitions, but based on the inventor's ability to properly define the concepts implied by the terms to best describe other Or she understands the principle of implementing the method of the present invention, these terms and words should be interpreted as having meanings and concepts related to the technical scope of the present invent...
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Abstract
Disclosed is a trench substrate, which includes a first insulating layer having trenches formed therein, a second insulating layer disposed on a lower surface of the first insulating layer and having laser processability inferior to that of the first insulating layer, and a negative pattern formed in the trenches, and in which the second insulating layer having laser processability inferior to that of the first insulating layer functions as a stopper, so that the trenches having the same shape are formed in the first insulating layer, thus enabling the formation of a fine and uniform circuit pattern. A method of fabricating the trench substrate is also provided.
Description
[0001] Cross References to Related Applications [0002] This application claims priority to Korean Patent Application No. 10-2009-0100997, filed Oct. 23, 2009, entitled "Trenched Substrate and Method of Making It," the entire contents of which are incorporated herein by reference . technical field [0003] The invention relates to a trench substrate and a preparation method of the trench substrate. Background technique [0004] In general, printed circuit boards (PCBs) are manufactured by forming copper wiring patterns on either or both surfaces of a board made of any type of thermosetting synthetic resin, arranging and mounting on the board ICs or electronic components, electrically connecting the ICs or electronic components, and coating the board with an insulator. [0005] Accompanying recent developments in the electronics industry is a rapidly growing demand for electronic components with increased functionality. There is also a need for a PCB mounting such electro...
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IPC IPC(8): H05K1/03H05K3/10
CPCH05K1/036H05K1/0366H05K3/0032H05K3/045H05K3/107H05K2201/0209H05K2201/029Y10T428/2462H05K3/10
Inventor 洪种国曹淳镇黄舜郁
Owner SAMSUNG ELECTRO MECHANICS CO LTD