Production method of circuit board

Abstract

The invention discloses a production method of a circuit board, comprising the following steps of: providing a circuit substrate comprising a product region and a non-product region, and forming a test circuit on the non-product region, wherein the product region comprises an edge connector region, and the test circuit comprises a test mark and two electric test points; providing a stamping mouldcomprising a first stamp die and a second stamp die, wherein the first stamp die is used for stamping the product region of the circuit substrate, and the second stamp die is used for forming a test through hole at the corresponding position of the test mark; stamping the circuit substrate by utilizing the stamping dies, wherein the first stamp die forms an opening at the region where the non-product region is adjacent to the edge connector region, and the second stamp die forms a test through hole at the test mark; and electrically testing the stamped circuit substrate, and judging whether astamping offset of the circuit substrate vertical to the extending direction of the edge connector region meets the requirement on an offset tolerance or not through testing the conduction condition of the two electric test points, thereby obtaining the circuit board of which the stamping offset meets the requirement on the offset tolerance.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a circuit board manufacturing method for detecting punching deviation of circuit board side joints. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of high-density interconnect circuit boards, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab., High density multilayer printed circuit board for HITAC M -880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] Circuit boards usually have edge connectors (commonly known as golden fingers) for interconnecting with other components. As the dimensions of electronic products and circuit boards continue to decrease, the misalignment tolerance requirements of opposite-side joints are also becoming higher and higher. During the stamping...

AI Technical Summary

Problems solved by technology

During the production process of the circuit board, due to the deviation of the alignment and the punching machine during the punching process, it is easy to cause the offset size of the edge joint obtained after punching to be greater than the offset tolerance

In the prior art, optical inspection (AOI) is usually used to detect the offset size of the circuit board edge connector. The above-mentioned optical inspection requires the use of high-precision image sensing devices, such as CCD, which are expensive. In addition, due to the offset The bit tolerance is usually very small, and the accuracy of the detection results of the image detection device is not high

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