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Method for processing precision device

A processing method and device technology, applied in the field of precision device processing, can solve the problems of slow processing speed, insufficient riveting strength, large surface burrs, etc., and achieve the effects of high processing precision, efficient processing method and high strength

Inactive Publication Date: 2012-05-23
SUZHOU UIGREEN MICRO & NANO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] ①The riveting strength of the product is not enough, and it will be separated in the subsequent process;
[0006] ② The size of the product does not meet the requirements;
[0007] ③ The product cannot meet the requirements after miniaturization
[0009] ① Unstable processing size:
[0010] ② Large surface burrs;
[0011] ③The processing speed is slow;
[0012] ④The processing fee is expensive

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0025] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0026] A precision device processing method, comprising the following steps

[0027] (1) The manufacturing step of the unit to be welded is to manufacture a plurality of sheet-shaped units to be welded with the same cross-sectional shape by stamping;

[0028] (2) A soldering point setting step, forming a soldering point by stamping on at least part of the surface to be welded of the unit to be welded;

[0029] (3) stacking step, stacking a plurality of units to be welded, so that solder joints are provided between every two adjacent units to be welded;

[0030] (4) Welding step, using the method of resistance welding to melt the soldering point, and welding the stacked devices to be welded.

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PUM

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Abstract

The invention discloses a method for processing a precision device. The method comprises the following steps of: (1) manufacturing units to be welded, namely manufacturing a plurality of sheet units to be welded which have the same cross-section shape; (2) setting auxiliary welding spots, namely forming the auxiliary welding spots on the surfaces to be welded of at least one part of units to be welded; (3) stacking, namely stacking the plurality of units to be welded to ensure that the auxiliary welding spots exist between every two adjacent units to be welded; and 4) welding, namely melting the auxiliary welding spots, and welding a stacked device to be welded. The disadvantages of the prior art are solved, and the method for processing the precision device in which processing strength and accuracy are high is provided.

Description

technical field [0001] The invention relates to a precision device processing method. Background technique [0002] The problems to be solved in precision machining are firstly machining accuracy, including shape and position tolerance, dimensional accuracy and surface condition, and sometimes whether there are surface defects is also the core of this problem; secondly, machining efficiency, some machining can achieve better machining accuracy, However, it is difficult to obtain high processing efficiency. [0003] In the prior art, for parts whose thickness is outside the stamping range, two manufacturing methods are mainly adopted: [0004] (1) Punching out a plurality of sheet parts, punching riveting points on each sheet part, and realizing it by lamination riveting. At the same time, this process also has its own defects, and its defects are mainly as follows: [0005] ①The riveting strength of the product is not enough, and it will be separated in the subsequent proc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P17/00B23K11/00
Inventor 钱晓晨骆兴顺
Owner SUZHOU UIGREEN MICRO & NANO TECH CO LTD