General platform system of uTCA hardware

A general-purpose platform and hardware technology, applied in digital data processing components, instruments, electrical digital data processing, etc., can solve the problems of AMC boards such as difficulty in heat dissipation, invisibility, waste, etc.

Active Publication Date: 2013-03-20
SUZHOU NEW SEA UNION TELECOM TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are also some 19-inch uTCA chassis on the market, but these products use standard uTCA power modules. Since the power module occupies the slot, these chassis can only support 10 full-height AMC boards. Although 4 A half-height AMC board can also reach the capacity of 12 AMC boards on these chassis
However, because the AMC board itself is very compact and the density of components on the board is very high, if it is to be made into a half-height size, on the one hand, the height of the components is difficult to meet the requirements, and on the other hand, it is very difficult for the half-height AMC board to dissipate heat. High-size AMC boards are very rare in the market
Therefore, the standard uTCA platform we purchased in the early stage can only use 10 AMC boards, and there are two half-height slots, so it is a waste of waste, and it does not meet the standard 12 AMC board capacity.
In the standard uTCA, the power supply of the AMC board is controlled by the power module. This feature makes the uTCA system very troublesome to use. Generally speaking, the power supply is only responsible for power supply. In the uTCA system, the power module needs to be connected with MCH and AMC. After the board communication, the power module supplies power to the functional modules, which involves some cumbersome IPMI communication protocols, which makes the power module very complicated, and it is difficult for ordinary manufacturers to develop; so sometimes it takes a long time to bring a power board. It takes time for debugging to allow the AMC board to be powered on; and the power module protocols of different manufacturers will be somewhat different, and the compatibility between them is not good. After debugging one power board and using another power module, you have to re-debug , although there are standards, the actual products are not fully compatible

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • General platform system of uTCA hardware
  • General platform system of uTCA hardware
  • General platform system of uTCA hardware

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] figure 1 A uTCA hardware universal platform system is shown, the main body is a chassis, which contains two power supply modules, an Oring circuit module with redundant power supply configuration, a backplane, and MCH modules and AMC modules installed side by side on the backplane A module and a fan cooling unit, wherein the power module is a common power module installed outside the backplane, 1 to 12 AMC modules, and 12 full-height AMC boards can run side by side at the same time. The system requires 220V AC or -48VDC input, +12V single output, and a power of 650W for the power module. The technical requirements for such a power module are much simpler than the standard uTCA power module, and it is easier to purchase on the market, and the price is lower Much cheaper, greatly reducing system costs. The AC or DC input power is converted by two power modules and outputs 12V_1 and 12V_2 respectively, and then these two power sources are mixed into one 12V output through...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a general platform system of uTCA hardware. The system is characterized in that: the main body is a chassis; two power supply modules, an Oring circuit module for power supply redundancy configuration, a rear panel, and a uTCA carrier hub (MCH) module, asynchronous communication control modules (ACM) and a fan radiating unit arranged in parallel on the rear panel are arranged in the chassis, wherein the power supply modules are common power supply modules and arranged on the exterior of the rear panel. The number of the ACM is 1 to 12; 12 full high-size ACM board cards can simultaneously run in parallel; and the rear panel is provided with hot plug control circuits which form one-to-one corresponding control relationships together with an MCH board block, ACM board blocks and the fan radiating unit respectively. A standard uTCA power supply board card is not adopted, and the common module power supply is adopted, so that the power supply management is simpler, difficulty and cost of developing a management level with low association with the system are reduced, double-MCH module master and slave backups are supported, the reliability is enhanced, 12 full configured full high-size advanced mezzanine card (AMC) modules are supported, and the capacity of the system is improved.

Description

technical field [0001] The invention relates to a carrier-level universal hardware platform, which is based on the uTCA standard, can be compatible with standard AMC boards, reduces hardware costs, increases capacity, and greatly enhances the uTCA hardware universal platform system. Background technique [0002] As a supplement to the AdvanedTCA standard, a popular modular hardware platform standard in today's industry, the uTCA hardware technology standard is mainly aimed at applications such as network communication, medical image processing, embedded control, and military industry. Its high bandwidth, modularization, and flexibility And the advantages of high cost performance have been applied to a wider range of application fields, and become the preferred standard for building a cost-effective modular standard hardware platform today. [0003] A typical uTCA system includes: 10 AMC (Advanced Mezzanine Card) modules, 1 or 2 MCH (uTCA Carrier Hub), interconnection backpla...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16G06F1/18
Inventor 陈卫明荆亚新王皓陈红杨秀云
Owner SUZHOU NEW SEA UNION TELECOM TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products