The invention discloses an optocoupler
chip and a packaging method of the optocoupler
chip, and relates to the field of
semiconductor electronic component packaging, and the optocoupler
chip comprises a substrate and a plurality of photoelectric
coupling modules arranged on the front surface of the substrate; the substrate is provided with a
signal circuit through a
copper-clad plate; the light receiving chip and the light emitting source are electrically connected to the
signal circuit through
lead bonding; the transparent
isolator covers the light receiving chip and the light emitting source; the back surface of the substrate is provided with a plurality of electric connectors used for being electrically connected with an
external circuit. According to the packaged
optical coupling chip, the limitation of the number of pins, the arrangement position and the space design is avoided, the
optical coupling chip can be more flexibly designed into various complex circuits matched with functions, the number of
signal electric connectors can be more than 100 easily, more complex integrated packaging with other SOC chips is achieved, and the
optical coupling chip is wide in application range, high in applicability and easy to popularize. The
optical coupler chip production device can meet the production requirements of double-channel or multi-channel
optical coupler chips, is small in size and occupied space, can be flexibly customized, and can meet the requirements of more application scenes.