PCB (Printed Circuit Board) grounding structure in flip phone

A PCB board, flip phone technology, applied in the direction of the phone structure and other directions, can solve the problems of destroying the antenna radiation pattern, performance deterioration, and antenna low-frequency radiation performance deterioration, etc., to eliminate the damage and ensure the work performance.

Inactive Publication Date: 2011-06-01
HUIZHOU SPEED WIRELESS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the antenna is designed at the lowest end of the lower flip of the clamshell mobile phone, there is a bad problem: when the mobile phone is in use with the cover open, the performance of the antenna in the low frequency band (such as GSM850; GSM900; CDMA800) will deteriorate sharply, causing the mobile phone The radiated power and receiving sensitivity are greatly reduced
In general, the low-frequency radiation pattern of a mobile phone antenna is similar to that of a half-wave dipole antenna; and if the mobile phone antenna is designed at the lowest end of the lower cover, when the mobile phone is in use with the cover open, the ground on the main board of the mobile phone will When the radio frequency current passes through the FPC connecting the display panel and the main board of the mobile phone, it will seriously damage the radiation pattern in the low frequency band of the antenna, making the radiation pattern chaotic and deteriorating the radiation performance of the antenna in the low frequency band

Method used

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  • PCB (Printed Circuit Board) grounding structure in flip phone
  • PCB (Printed Circuit Board) grounding structure in flip phone
  • PCB (Printed Circuit Board) grounding structure in flip phone

Examples

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Embodiment Construction

[0017] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] Such as Figure 1-3 As shown, the flip mobile phone PCB board grounding structure disclosed in this embodiment is to install a metal shrapnel 3 in the upper cover casing, and an elastic spring foot is arranged at both ends of A and B of the metal shrapnel 3, and the A end bounces. The feet are directly in contact with the ground of the display board 2 in the upper cover casing 1 through elastic force. The main board 2 of the display screen is exposed to copper at the contact point area with the spring foot of the A end of the metal shrapnel 3, and the spring foot of the B end of the metal shrapnel 3 is directly in contact with the metal shaft 4 through the action of elastic force. The B-end spring foot of 3 and the contact point area of ​​metal rotating shaft 4 are made through gap. In this way, the ground of the display panel 2 is directly electrically conn...

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PUM

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Abstract

The invention relates to the technical field of antennae of mobile terminals, in particular to a PCB (Printed Circuit Board) grounding structure designed for ensuring the antenna performance in a flip phone. The PCB grounding structure is characterized in that a metal elastic sheet is additionally arranged in an upper turning cover of the flip phone, the ground on a display screen mainboard is connected to a rotating shaft of an upper cover and a lower cover, meanwhile, a conductive paint clad layer is sprayed on a region of a lower turning cover housing around the rotating shaft, and the ground of a phone mainboard is connected to the conductive clad layer through a conductive sponge. The connecting mode ensures that a capacitive coupling effect exists between the ground of the phone mainboard and the ground of the display screen mainboard to form another new loop and to be used for offsetting an interference loop effect generated by a radio frequency current flowing through an FPC (Flexible Printed Circuit), thereby effectively solving the problem of performance deterioration of a low-frequency band of the antenna when the built-in antenna in the flip phone is designed at the lower end of the lower turning cover.

Description

technical field [0001] The invention relates to the technical field of mobile terminal equipment antennas, in particular to a PCB board grounding structure designed to ensure the performance of the antenna in a flip phone. Background technique [0002] With the rapid development of mobile communication in recent years, consumers' demand for mobile communication terminals is also increasing. Mobile phones are the representative products of mobile communication terminals. With the change of user's concept of use and needs, the structural type of mobile phones has developed from the single bar type in the early stage to new mobile phone structures such as clamshell type and sliding type. In particular, the clamshell mobile phone has won the favor of consumers with its exquisite and unique new concept shape, and has become one of the mainstream types of modern mobile phones. The market demand makes modern mobile phones tend to be more and more miniaturized and low-profile. Corr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02
Inventor 郭樟平熊鹏吴荻
Owner HUIZHOU SPEED WIRELESS TECH CO LTD
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