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LED package and RFID system including the same

A technology of LED packaging and LED devices, applied in the field of RFID tags, can solve the problems of small operating range and slow recognition speed

Active Publication Date: 2015-07-22
SK HYNIX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the RFID system operates in a low frequency band, the recognition speed becomes slower and the operating range becomes smaller, but the recognition rate is less affected by the external environment
Otherwise, if the RFID system operates in a higher frequency band, the recognition speed becomes faster and the operating range becomes wider, but the recognition rate is more affected by the external environment

Method used

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  • LED package and RFID system including the same
  • LED package and RFID system including the same
  • LED package and RFID system including the same

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Embodiment Construction

[0034] Next, specific embodiments of the present invention will be described with reference to the drawings. The drawings are not to scale and, in some instances, scale may have been exaggerated in order to more clearly show certain features of the invention.

[0035] figure 2 is a block diagram of a radio frequency identification (RFID) chip 100 in an RFID package according to one embodiment of the present invention. As shown in the figure, the RFID chip 100 includes an antenna unit ANT, a modulator 110, a demodulator 120, a power-on reset unit 130, a clock generator 140, a digital processing unit 150, an operation controller 160, an information processing unit 170 and a plurality of Pads PAD1 to PADn. Here, the plurality of pads PAD1 to PADn are coupled to the external operation control device 200 .

[0036] The antenna unit ANT receives the wireless signal RF_EXT transmitted from the RFID reader. The antenna unit ANT outputs the wireless signal RF_EXT to the RFID chip ...

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PUM

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Abstract

The LED package comprising a substrate and a display device, stacked on the substrate, including a light emitting diode (LED), and so on. A light emitting diode (LED) package comprises a LED device configured to emit light, an electrostatic discharge (ESD) device including an ESD circuit formed under the LED device, a printed circuit board (PCB), including a power supply line, formed under the ESD device, and a heat sink substrate, formed under the PCB, configured to release a heat delivered from the LED device through the ESD device and PCB.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority to Korean Patent Applications Nos. 10-2009-0129394 and 10-2009-0129399 filed on December 23, 2009, the entire contents of which are hereby incorporated by reference. technical field [0003] Embodiments of the present invention relate to light emitting diode (LED) packages and RFID systems; in particular, RFID tags configured to communicate with external readers by transceiving wireless signals to control the LED packages. Background technique [0004] Radio Frequency Identification (RFID) is a communication method that provides contactless identification by using an RFID chip attached to an identification target and an RFID reader configured to transmit a wireless signal using the RFID chip. RFID can improve existing optical character recognition technology and advance existing automatic identification systems such as bar code systems. [0005] In recent years, RFID sy...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/64G06K7/00G06K19/077
CPCH05K3/0061H05K2201/10106H01L33/62H05K1/0259H01L33/64H01L2224/16H05K2201/10515H05K1/113H01L25/167
Inventor 姜熙福金址默
Owner SK HYNIX INC