High-temperature reflow soldering process for printed circuit board (PCB)

A printed circuit board, high-temperature reflow technology, applied in the direction of assembling printed circuits with electrical components, can solve the problems of damage to PCB board components, high production costs, high energy consumption of high-temperature reflow soldering heads, to avoid thermal energy dissipation, improve energy Utilization, the effect of maintaining welding efficiency

Inactive Publication Date: 2011-06-29
东莞市健时自动化设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above two cases, the high-temperature reflow soldering joint remains in the high-temperature soldering state even when it is in a non-welding state. The high-temperature reflow soldering joint consumes high energy, seriously wastes electric energy, is not energy-saving, is not environmentally friendly, and has high production costs. And there is a risk of damaging components on the PCB

Method used

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Effect test

Embodiment approach

[0022] The embodiment of a kind of printed circuit board high temperature reflow soldering process of the present invention is as follows, comprises the following steps:

[0023] Soldering printed circuit boards through high temperature reflow soldering joints;

[0024] By arranging a board-feeding light sensor for induction welding of printed circuit boards in the work area, the board-feeding light sensor recognizes the welding state and non-welding state of the high-temperature reflow soldering joint;

[0025] By setting up a control unit, the control unit is connected to the wind frequency converter, and the control unit controls the frequency of the high-temperature reflow soldering joint according to the signal of the optical eye sensor entering the board;

[0026] When the high temperature reflow soldering joint is in the soldering state, the control unit increases the frequency of the high temperature reflow soldering joint;

[0027] When the high-temperature reflow so...

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PUM

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Abstract

The invention discloses a high-temperature reflow soldering process for a printed circuit board (PCB). In the soldering process, a feed plate optical eye sensor for sensing the PCB within a soldering operation area is arranged, and the feed plate optical eye sensor is used for identifying a soldering status and a non-soldering status of a high-temperature reflow soldering joint; when the high-temperature reflow soldering joint is in the soldering status, a control unit improves the frequency of the high-temperature reflow soldering joint; and when the high-temperature reflow soldering joint is in the non-soldering status, the control unit reduces the frequency of the high-temperature reflow soldering joint, so that the original soldering performance and the original soldering efficiency of the high-temperature reflow soldering joint are maintained. Compared with the prior art, by the high-temperature reflow soldering process for the PCB, 2 to 8 KWH of electric power can be reduced during normal use, the energy utilization ratio can be improved, and the carbon emission can be reduced. Furthermore, the invention is environmentally friendly and energy saving and has a low carbon effect.

Description

technical field [0001] The invention relates to the technical field of high-temperature reflow soldering technology, in particular to a high-temperature reflow soldering technology for printed circuit boards. Background technique [0002] In the prior art, in the soldering process of the printed circuit board (PCB), the printed circuit board is soldered by high temperature reflow soldering. After operation, the conveyor belt will move the soldered printed circuit board out of the welding operation area, and the conveyor belt will move another printed circuit board into the welding operation area. During the process of replacing the printed circuit board, the high-temperature reflow soldering head remains in the high-temperature soldering state . [0003] In addition, in the process of soldering the same printed circuit board by the high-temperature reflow soldering head, after the high-temperature reflow soldering head completes the soldering operation on the first componen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 陈晓凡
Owner 东莞市健时自动化设备有限公司
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