High-temperature reflow soldering process for printed circuit board (PCB)

Abstract

The invention discloses a high-temperature reflow soldering process for a printed circuit board (PCB). In the soldering process, a feed plate optical eye sensor for sensing the PCB within a soldering operation area is arranged, and the feed plate optical eye sensor is used for identifying a soldering status and a non-soldering status of a high-temperature reflow soldering joint; when the high-temperature reflow soldering joint is in the soldering status, a control unit improves the frequency of the high-temperature reflow soldering joint; and when the high-temperature reflow soldering joint is in the non-soldering status, the control unit reduces the frequency of the high-temperature reflow soldering joint, so that the original soldering performance and the original soldering efficiency of the high-temperature reflow soldering joint are maintained. Compared with the prior art, by the high-temperature reflow soldering process for the PCB, 2 to 8 KWH of electric power can be reduced during normal use, the energy utilization ratio can be improved, and the carbon emission can be reduced. Furthermore, the invention is environmentally friendly and energy saving and has a low carbon effect.

Description

technical field [0001] The invention relates to the technical field of high-temperature reflow soldering technology, in particular to a high-temperature reflow soldering technology for printed circuit boards. Background technique [0002] In the prior art, in the soldering process of the printed circuit board (PCB), the printed circuit board is soldered by high temperature reflow soldering. After operation, the conveyor belt will move the soldered printed circuit board out of the welding operation area, and the conveyor belt will move another printed circuit board into the welding operation area. During the process of replacing the printed circuit board, the high-temperature reflow soldering head remains in the high-temperature soldering state . [0003] In addition, in the process of soldering the same printed circuit board by the high-temperature reflow soldering head, after the high-temperature reflow soldering head completes the soldering operation on the first componen...

AI Technical Summary

Problems solved by technology

[0004] In the above two cases, the high-temperature reflow soldering joint remains in the high-temperature soldering state even when it is in a non-welding state. The high-temperature reflow soldering joint consumes high energy, seriously wastes electric energy, is not energy-saving, is not environmentally friendly, and has high production costs. And there is a risk of damaging components on the PCB