Assembly for measuring and comparing heat conduction and heat conductivities of different materials and using method thereof

Abstract

The invention relates to a device for testing and comparing the heat conductivities of materials by using a material analysis method and a using method thereof, in particular to an assembly for measuring, comparing and further researching the heat flows, the heat condition and the heat conductivities of different materials and a using method thereof. The device comprises a hollow heat insulation shell and fixing components, wherein heat mass can be added in the shell; the fixing components are used for fixing the tested materials and respectively have an injection channel consisting of a first injection opening and a second injection opening; a space for containing heat is formed between the fixing components and the heat insulation shell; on the fixing components, a plurality of fixing holes for installing the columns of the tested materials are evenly arranged on the circumferences taking the geometric centers of the second injection openings as centers; and one ends of the columns of the tested materials extend into the space for containing the heat mass and the other ends are respectively in contact with a temperature sensor, therefore, the assembly provided by the invention is not influenced by the outside world and can carry out measurement correctly; and simultaneously, the invention also provides a preferable method for measuring by using the assembly.

Description

technical field [0001] The present invention relates to a device for testing material heat conduction and a method for using thermal methods for testing or analyzing materials, and more specifically refers to a component for measuring, comparing and further studying the heat flow, heat conduction and thermal conductivity of different materials and its Instructions. Background technique [0002] In the process of updating the production process of industrial products or the research and development of functional materials involved in the experiment process, it is necessary to accurately measure and compare the heat flow, thermal conductivity and thermal conductivity in the material, and further provide data support for the research, but The accuracy of this test has not been able to meet the needs of engineering, the reason is that there is no suitable measurement components. [0003] In the existing technology, the testing methods of thermal conductivity and thermal conduct...

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Problems solved by technology

[0008] (2) Secondly, in order to control the test very well, the shapes and positions of the candles attached to different rods should be exactly the same, but this is difficult to achieve in practical applications;

[0009] (3) The flame used in this test is not suitable for some relatively small students. In addition, the flame will cause damage to materials such as plastics and wood, so this test is only suitable for the test of metal thermal conductivity;

[0010] (4) In addition, the time to perform this test is quite long, especially when the tested material has very poor thermal conductivity, which will result in a very long time for the candle to melt and fall from the rod

[0011] (5) Again, the rod will lose heat due to the surrounding air, so prolonging the entire test may cause errors in the entire experiment, and the candle may not even fall from the rod during the entire test. down;

[0012] (6) Finally, because this test method is not accurate enough, it will be very difficult to compare the thermal conductivity of materials with similar thermal conductivity

[0014] Similarly, the method of approximate steady state method is also adopted in the technical solution disclosed in the above-mentioned Chinese invention patent, but it still does not avoid the shortcomings of the prior art such as the test time is too long and the test is not stable.

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