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LED fluorescent powder spraying process

A phosphor and LED chip technology, applied in coatings, devices for coating liquid on the surface, etc., can solve problems such as color dispersion, uneven light output, yellow circles, and baskets, and achieve uniform thickness and consistency. Control, the effect of product color zone concentration

Inactive Publication Date: 2013-07-17
惠州市华阳光电技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the traditional glue dispensing process is to mix powder glue and defoam it on the surface. After baking, the surface of the LED chip will form an arc-shaped structure with a thick middle and thin sides, resulting in a large amount of phosphors with low excitation efficiency and poor light output. Uniform, and there will be yellow circles and baskets, the consistency of the product is difficult to control, and the color areas are scattered

Method used

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  • LED fluorescent powder spraying process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The LED phosphor spraying process provided in this embodiment includes the following steps:

[0018] (1) Mix the fluorescent powder, adhesive material and volatile solvent evenly to make a mixed liquid of fluorescent powder, and load it in the glue spraying machine; (2) Fix the bracket of the LED chip 1 that has been welded on the fixture; ( 3) Make a mold according to the structure of the LED bracket and the chip 1, the baffle plate 2 of the mold is placed on the top of the LED chip 1, with a certain gap, and the horizontal distance between the baffle plate 2 and the periphery of the LED chip 1 is equal; (4) spray The glue machine 3 sprays the phosphor powder mixture on the surface of the chip 1 through the baffle plate 2, and the baffle plate 2 has played a better role in controlling the directionality of spraying, and the phosphor powder mixture completely surrounds the side and top of the chip 1; ( 5) The heat transferred by the auxiliary heating system of the base ...

Embodiment 2

[0020] The LED phosphor spraying process provided in this embodiment includes the following steps:

[0021] (1) Mix the fluorescent powder, adhesive material and volatile solvent evenly to make a mixed solution of fluorescent powder, and load it in the glue spraying machine; (2) Fix the bracket of the LED chip 1 that has been welded on the fixture; ( 3) Make a mold according to the structure of the LED bracket and the chip 1, the baffle plate 2 of the mold is placed on the top of the LED chip 1, with a certain gap, and the horizontal distance between the baffle plate 2 and the periphery of the LED chip 1 is equal; (4) spray The glue machine 3 sprays the phosphor powder mixture on the surface of the chip 1 through the baffle plate 2, and the baffle plate 2 has played a better role in controlling the directionality of spraying, and the phosphor powder mixture completely surrounds the side and top of the chip 1; ( 5) The heat transferred by the auxiliary heating system of the bas...

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Abstract

The invention discloses a light emitting diode (LED) fluorescent powder spraying process, which comprises the following steps: (1) uniformly mixing fluorescent powder, a glue material and a volatile solvent to prepare mixed solution of the fluorescent powder, and loading the mixed solution in a glue spraying machine; (2) fixing the bracket of an LED chip which is soldered with a wire on a clamp; (3) making a mold according to the structure of the LED bracket and the LED chip, wherein the baffle plates of the mold are positioned on the upper part of the LED chip and form a certain gap with the upper part of the LED chip, and the horizontal distances between the baffle plates and the periphery of the LED chip are equal; (4) the glue spraying machine sprays the mixed solution of the fluorescent powder onto the surface of the chip through the baffle plates, wherein the mixed solution of the fluorescent powder covers the side faces and the top part of the chip completely; and (5) violating the volatile solvent with the left fluorescent powder coated on the chip, and loading and forming the appearance glue. Compared with the prior art, the LED chip manufactured by using the LED fluorescent powder spraying process has the advantages that: the thickness of fluorescent powder is more uniform; the color zones of the product are centralized; and the consistency is easier to control.

Description

technical field [0001] The invention relates to the field of LED processing, and specifically refers to an LED fluorescent powder spraying process. Background technique [0002] In the process technology of LED white light, the thickness of the phosphor layer excited by blue light seriously affects the luminous light efficiency of the phosphor and the light effect of the final product. The uniformity of the phosphor thickness also has a great influence on the consistency and yield of the product. Therefore, the phosphor coating technology has a significant impact on the LED manufacturing process. [0003] At present, the traditional glue dispensing process is to mix powder glue and defoam it on the surface. After baking, the surface of the LED chip will form an arc-shaped structure with a thick middle and thin sides, resulting in a large amount of phosphors with low excitation efficiency and poor light output. Even, and there will be yellow circles and baskets, the consiste...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D7/00B05C9/14B05C11/00
Inventor 郭晓君王峰
Owner 惠州市华阳光电技术有限公司