Method for tightly combining heat radiation fin with heat pipe
A technology of heat dissipation fins and heat pipes, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., and can solve the problems of copper-platinum laminate detachment and affecting heat transfer performance, etc.
Active Publication Date: 2011-07-13
SY THERMAL
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Problems solved by technology
[0004] Also, the combined structure of heat sinks and heat pipes of conventional radiators, such as Taiwan’s new patent No. M268111, mainly forms a through hole for implanting a heat supply pipe in the heat sink, inserts the heat pipe into the through hole, and stamps it through a molding die. The heat pipe is deformed and tightly integrated with the heat sink; in the previous structure, since the inner wall of the heat pipe is copper-platinum laminated, the copper-platinum laminated layer will fall off when the molding die is stamped and affect the heat transfer performance
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[0023] Herein, the features of the present invention are described in detail in conjunction with the accompanying drawings, so as to make them more clear.
[0024] A kind of heat dissipation fin and heat pipe fastening method of the present invention, its basic method step is to comprise (referring to Figure 1A , Figure 1B ), first provide a heat dissipation fin 1, one side of the heat dissipation fin 1 is provided with a groove 13 for fitting and accommodating the heat pipe 2, and the fitting space of the two inner walls of the heat pipe 2 corresponding to the groove 13 is not larger than that of the heat pipe 2 ; Put the heat pipe 2 into the groove 13, and the pressed heat pipe 2 is forced to join the heat pipe 2 because the notch of the groove 13 shrinks inward.
[0025] Further, in order to provide a good tightening effect, specific embodiments such as Figure 1A to Figure 1D , which is a schematic diagram of the fastening method of heat dissipation fins and circular he...
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The invention relates to a method for tightly combining a heat radiation fin with a heat pipe. A groove is formed on one side edge of the fin, positioning parts are further convexly arranged on two sides of the groove respectively, the heat pipe is combined after being placed into the groove, and a pressing die is used for pressing the fin so as to enable the two positioning part to bend and deform inwards, enable a notch of the groove to deform slightly and contract and further press and clamp the heat pipe; and another embodiment is that, a guide trench is further molded on the outer edge of each positioning part, the pressing die is also provided with convex parts corresponding to the guide trenches, when the pressing die is used for pressing, and the convex pars can be just embedded in the guide trenches, thereby enabling the parts between the positioning parts and the groove to deform and contract, further pressing and clamping the heat pipe, simplifying the procedure for fixing the heat pipe with the fin, and ensuring the close joint between the heat pipe and the fin.
Description
technical field [0001] The invention relates to radiators, especially radiators containing heat pipes and fins, and a fastening method thereof. Background technique [0002] As the speed and performance of semiconductor components and electronic equipment continue to increase, their heat generation is also doubling day by day, and the heat dissipation requirements of semiconductor components or light-emitting diode (LED) lamps are also increasing. With the development, the accommodating space that the heat sink can occupy is further limited, so the performance of the heat sink faces great challenges. [0003] In order to maximize heat dissipation performance within a limited volume, heat dissipation fins must be combined with heat pipes to accelerate heat conduction through the rapid heat conduction of heat pipes. The heat pipe needs to be tightly bonded to each fin in order to truly conduct heat. However, only a linear contact can be formed between the heat pipe and the fi...
Claims
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Login to View More IPC IPC(8): H01L21/48H01L23/367H01L23/427
Inventor 陈世明
Owner SY THERMAL