Connecting plate for test socket

Abstract

The invention discloses a connecting plate for a test socket. A three-phase drawnwire switch is arranged corresponding to each pin of a test socket, and each pin of the test socket can be selectively connected to a ground signal, a power supply signal or an external test signal so as to change the signal state of the pin of the test socket according to product test needs and provide abundant and stable signal resources. In addition, the connecting plate for the test socket, provided by the invention, is adopted to avoid manufacturing a great amount of test boards in testing products in the same encapsulation mode because of the abundant and stable signal resources, and the test reusability of the finished product is high so as to save the hardware cost investment of the test. Furthermore,preparation time for testing a new product can be greatly shortened because of the abundant and stable signal resources.

Description

Technical field [0001] The invention relates to the field of integrated circuit testing, in particular to a test socket connection board. Background technique [0002] The test of integrated circuit products usually requires the use of a corresponding tester and test board (DUT board), such as a test board for function test (FT). FT test is an indispensable link to check the function of integrated circuit products. Usually, a test socket for placing the chip to be tested is connected to the test board, and the external test signal provided by the test machine is sent to the pins of the test socket through the test board, and then the chip to be tested is tested. [0003] The prior art has the following shortcomings: to test different types of integrated circuit products, different test boards need to be made to weld different test sockets. There is a one-to-one connection between the currently used test board and the test socket, which limits the application of the test board. M...

AI Technical Summary

Problems solved by technology

[0003] The prior art has the following disadvantages: for the testing of different types of integrated circuit products, it is necessary to make different test boards and weld different test sockets

There is a one-to-one connection between the test board and the test socket currently used, which limits the application of the test board

Moreover, for highly integrated chips, the signal pins are complicated. On the one hand, the signal resources that the test machine itself can provide are limited;

In addition, in order to realize multiple signal sources, jumpers are usually soldered on the test board, which will seriously damage the test board and is not conducive to long-term use

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