Method and system for judging mask defects

Abstract

The invention relates to a method for judging mask defects, which comprises providing a mask with graphs and different wafers, and transferring the graphs of the mask to different wafers; acquiring the graphs of the wafers, and judging whether the wafers have defects or not and judging the positions at which the defects are positioned on the wafers; providing a position threshold value, comparingthe positions of the defects positioned on different wafers, and if the position difference of defects positioned on different wafers is less than the position threshold value, determining that the defects are positioned in the same area; and providing a preset value, if the number of the wafers in which the defects within the same area are positioned exceeds the preset value, determining that the defects occur on the corresponding position of the mask. The invention also provides a system for judging the mask defects, which realizes the function of judging the defects of the mask on line so as to judge the mask with the defects in time with accurate judging effect and high judging efficiency.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a method and system for judging a mask plate defect. Background technique [0002] In the field of semiconductor manufacturing, photolithography is an important process for forming integrated circuit patterns. The process includes: first coating a layer of photoresist on the die, then exposing a mask with a reference pattern in a photolithography device, and transferring the reference pattern on the mask to the photoresist. Finally, the developer reacts with the photoresist to form a corresponding pattern on the wafer. [0003] As a reference pattern in the lithography process, the mask plays an important role in the lithography and subsequent processes. Fiducial patterns are destroyed when contamination or damage occurs on the reticle. The destroyed reference pattern will be transferred to tens of thousands of wafers through exposure, development and subsequent etching...

AI Technical Summary

Problems solved by technology

However, the non-repeatability of the mask determines the diversity of the graphics environment where the defects on the mask are located. The only few defect inspection settings on the inspection machine are difficult to be suitable for each mask.

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