Encapsulation structure of light-emitting diode (LED) and manufacturing method thereof
A technology of light-emitting diodes and light-emitting structures, applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as lengthy time, increased opportunities for defective products, and numerous steps, and achieve the effect of simple manufacturing process and reduced opportunities for defective products
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[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings.
[0031] See figure 1 A light emitting diode packaging structure 100 provided by the embodiment of the present invention includes a substrate 10, a light emitting structure 20, a packaging glue 30, and a circuit structure 40.
[0032] The substrate 10 has a first surface 11 and a second surface 12 opposite to the first surface 11. In this embodiment, a first groove 111 is formed on the first surface 11, and the first groove 111 is a stepped groove, which includes a first receiving portion 111a and a second receiving portion 111b. A step surface 111 c is formed between the first accommodating portion 111 a and the second accommodating portion 111 b, and the step surface 111 c is substantially parallel to the first surface 11. Preferably, the first accommodating portion 111a and the second accommodating portion 111b are both horn-shaped to facilitate light reflection...
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