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Encapsulation structure of light-emitting diode (LED) and manufacturing method thereof

A technology of light-emitting diodes and light-emitting structures, applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as lengthy time, increased opportunities for defective products, and numerous steps, and achieve the effect of simple manufacturing process and reduced opportunities for defective products

Inactive Publication Date: 2012-02-01
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the manufacturing process of this LED packaging structure, it is necessary to clamp and position the LED chip, which results in a lengthy manufacturing process and increases the chance of defective products due to numerous steps

Method used

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  • Encapsulation structure of light-emitting diode (LED) and manufacturing method thereof
  • Encapsulation structure of light-emitting diode (LED) and manufacturing method thereof
  • Encapsulation structure of light-emitting diode (LED) and manufacturing method thereof

Examples

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Embodiment Construction

[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0031] see figure 1 A light emitting diode packaging structure 100 provided in an embodiment of the present invention includes a substrate 10 , a light emitting structure 20 , a packaging glue 30 and a circuit structure 40 .

[0032] The substrate 10 has a first surface 11 and a second surface 12 opposite to the first surface 11 . In this embodiment, a first groove 111 is formed on the first surface 11, and the first groove 111 is a stepped groove, which includes a first accommodating portion 111a and a second accommodating portion 111b. A stepped surface 111c is formed between the first accommodating portion 111a and the second accommodating portion 111b, and the stepped surface 111c is substantially parallel to the first surface 11 . Preferably, both the first accommodating portion 111a and the second accommodating portion 111b are trumpet-shaped to facil...

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PUM

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Abstract

The invention relates to an encapsulation structure of a light-emitting diode (LED). The encapsulation structure of the LED comprises a substrate, a light-emitting structure, encapsulation glue and a circuit structure, wherein the substrate comprises a first surface and a second surface opposite to the first surface; the light-emitting structure grows on the first surface; the encapsulation glue is formed on the first surface and covers the light-emitting structure; and the circuit structure is formed on the second surface of the substrate and is electrically connected with the light-emitting structure. The invention also relates to a manufacturing method for the encapsulation structure of the LED.

Description

technical field [0001] The invention relates to a semiconductor package structure, in particular to a light emitting diode package structure and a manufacturing method thereof. Background technique [0002] Now, light emitting diodes (Light Emitting Diode, LED) have been widely used in many fields. LEDs generally emit light of a specific wavelength, such as visible light. In the manufacturing process of the traditional LED packaging structure, it is first necessary to provide a wiring base for carrying the LED chip, and then attach the LED chip to the wiring base and electrically connect with the circuit on the wiring base. During the manufacturing process of the LED packaging structure, it is necessary to clamp and position the LED chip, which results in a long time for the entire manufacturing process and increases the chance of defective products due to numerous steps. Contents of the invention [0003] In view of this, it is necessary to provide a light-emitting diod...

Claims

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Application Information

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IPC IPC(8): H01L33/62
Inventor 沈佳辉洪梓健曾坚信
Owner ZHANJING TECH SHENZHEN
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