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Double-fan heat-dissipating device

A heat dissipation device and dual fan technology, applied in the direction of cooling/ventilation/heating transformation, to achieve the effect of reducing noise and improving heat dissipation efficiency

Active Publication Date: 2011-07-27
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As for the M 245506 patent, which discloses a heat dissipation mechanism in which one of the two fans is inclined, it is still limited to the fact that the two fans are respectively arranged on two opposite sides of the heat dissipation mechanism.

Method used

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  • Double-fan heat-dissipating device
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  • Double-fan heat-dissipating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] figure 1 A preferred example of a dual-fan cooling device of the present invention is shown. The dual-fan cooling device 1 is used on a circuit board 2. The dual-fan cooling device 1 includes a windshield 3, a first fan 4, and a second fan 5. , a cooling module 6 and a partition 31 . The circuit board 2 can be a display card or a mainboard, etc. The first fan 4 and the second fan 5 are preferably axial flow fans, but not limited thereto.

[0021] figure 2 A schematic diagram of the windshield 3 of the dual-fan cooling device 1 of the present invention is indicated. The windshield 3 covers the heat dissipation module 6, the windshield 3 has a cover plate 30, the lower wall 300 of the cover plate 30 is facing the top of the heat dissipation module 6, and the cover plate 30 has an upper wall running through it. 301 and a first through hole 302 and a second through hole 303 of the lower wall 300 .

[0022] The partition 31 is disposed in the windshield 3 between the f...

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PUM

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Abstract

The invention discloses a double-fan heat-dissipating device applied to a circuit board. The double-fan heat-dissipating device comprises a heat-dissipating module, a fan cover, a first fan, a second fan and a separating component. The fan cover is provided with a cover plate. The lower wall of the cover plate faces to the heat-dissipating module and the cover plate is provided with a first through hole and a second through hole. The first fan is arranged on the fan cover in an aslant way and in the first through hole. The second fan is arranged on the fan cover in an aslant way and in the second through hole. The virtual axis of a rotating center of the second fan and the virtual axis of a rotating center of the first fan are intersected outside the upper wall of the cover plate. The separating component is arranged in the fan cover and between the first through hole and the second through hole. The separating component separates the first fan from the second fan.

Description

technical field [0001] The present invention relates to a heat dissipation device for a circuit board or an electronic device, in particular to a dual-fan heat dissipation device with a structural design of relatively inclined fans. Background technique [0002] With the rapid development of technology, it has become a trend for electronic devices to use higher-level integrated circuits to enhance their computing capabilities. However, when the integrated circuit performs calculations, the integrated circuit will generate a large amount of heat energy, and the integrated circuit needs to be assisted by a cooling device to dissipate heat. At present, the cooling device includes a single fan and a double fan design. Various approaches, such as: [0003] China Taiwan No. 587769 "radiation device" patent discloses a method of installing a heat dissipation device on a heating element, and the heat dissipation device includes more than one intake fan and an exhaust fan; [0004]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 黄顺治毛黛娟
Owner GIGA BYTE TECH CO LTD