Core burying method for high-current magnetic device and printed circuit board manufacturing method

Abstract

The embodiment of the invention discloses a core burying method for a high-current magnetic device and a printed circuit board manufacturing method. The embodiment of the invention can bury a core and a winding into a printed circuit board (PCB) so as to save a surface space of the PCB and realize the miniaturization of a power module. The core burying method of the embodiment of the invention comprises the following step of: burying the core into the PCB, wherein a magnetic circuit produced by the core and a plane of the PCB form a horizontal structure; a winding sequentially comprises an upper PCB of the core, in-ring through holes, a lower PCB of the core, and outside-ring through holes; the winding and the plane of the PCB form a vertical structure; and the upper PCB and lower PCB of the winding are arranged in a staggering way.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a magnetic embedding method of a large current magnetic device and a manufacturing method of a printed circuit board. Background technique [0002] With the increase in the integration of electronic products, the miniaturization requirements for power modules are getting higher and higher, which makes it necessary to reduce the layout space of devices. As the core components of power modules, magnetic devices account for about 30-40% of power modules. Printed circuit board (PCB, Printed Circuit Board) space has become a key factor restricting the miniaturization of power modules. At present, there are mainly two types of magnetic device application technologies commonly used in power modules: independent surface-mounted magnetic devices and single-board PCB buckle magnetic solutions. Among them, the independent surface-mounted magnetic Layer-to-layer interconnection forms a ...

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Problems solved by technology

[0003] In the process of realizing the embodiment of the present invention, the inventors found the following technical problems in the prior art: the independent surface-mounted magnetic device and the magnetic device of the single-board PCB buckle magnet scheme are all located on the surface of the PCB, and the magnetic device is the height of the power module. The tallest device takes up a lot of PCB surface space, which makes the layout of other components of the power module tight, which is not conducive to the miniaturization of the power module

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