Film sticking equipment and film sticking process using same

Abstract

The invention discloses a film sticking equipment. The film sticking equipment comprises a conveying device for conveying printed circuit boards to be stuck with films, a film pressing roller, a liquid spraying roller and a liquid absorbing roller, wherein the liquid spraying roller humidifies the surface of the printed circuit board; the liquid absorbing roller homogenizes the liquid distribution at the surface of the printed circuit board; and the film pressing roller presses a film the homogenized printed circuit board surface. In the film sticking equipment, the liquid spraying roller and the liquid absorbing roller are additionally arranged; the liquid spraying roller humidifies the surface of the printed circuit board and the liquid absorbing roller homogenizes the liquid distribution at the surface of the printed circuit board, so that air bubbles caused by concave-convex surface of the printed circuit board and gaps between circuits are removed, absolute vacuum is ensured to be formed between the surface of the printed circuit board and the stuck film when the film is stuck, and the film sticking yield is improved. Simultaneously the invention further provides a film sticking process using the film sticking equipment.

Description

technical field [0001] The invention relates to a film sticking device and a film sticking process thereof, in particular to a wet film sticking device for a printed circuit board and a film sticking process using the film sticking device. Background technique [0002] With the rapid development of manufacturing technology in the printed circuit board industry, flexible printed circuit boards and soft-rigid printed circuit boards have been widely used, and the sophistication and complexity of circuit design have been greatly improved. Therefore, higher requirements are put forward for the printed circuit board manufacturing process. Require. In the plate-making process of circuit film for printed circuit boards, it is necessary to press and apply imaging dry film on the surface of copper foil. At present, the widely used hard board film laminating process, that is, the way of hot roller pressing dry film and copper foil-clad circuit board embryonic board has been It cannot ...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of prior art film sticking equipment and film sticking process that air bubbles are easily produced on the surface of copper foil, affecting product appearance, low product yield and cost increase, it is necessary for the present invention to provide a method for effectively removing bubbles to ensure that the surface of the printed circuit board is consistent with the required film sticking. An absolute vacuum is formed between the films, which improves product yield and reduces costs.

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