Film sticking equipment and film sticking process using same

A film sticking equipment and film sticking technology, applied in the direction of layered products, lamination devices, lamination, etc., can solve the problems of increased cost, low product yield, affecting product appearance, etc., to improve appearance, improve product yield, increase The effect of the success rate of the filming process

Inactive Publication Date: 2011-08-24
MEIZHOU ZHIHAO ELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of prior art film sticking equipment and film sticking process that air bubbles are easily produced on the surface of copper foil, affecting product appearance, low product yield and cost increase, it is necessary for the present i

Method used

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  • Film sticking equipment and film sticking process using same
  • Film sticking equipment and film sticking process using same
  • Film sticking equipment and film sticking process using same

Examples

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Embodiment Construction

[0014] The present invention will be described below in conjunction with the accompanying drawings.

[0015] The embodiment of the present invention provides a film sticking device. Please refer to the attached drawing, which is a functional structural diagram of a preferred embodiment of the film sticking device of the present invention. The film body 200 and the printed circuit board 300 to be laminated are provided to the film sticking equipment 1 , and the film body 200 is pressed onto the surface of the printed circuit board 300 through the film sticking device 1 .

[0016] The film sticking equipment 1 includes a box body 100 , a conveying device 11 , a liquid spraying device 13 , a lamination device 15 and a control system 17 . The box 100 includes a storage space for accommodating the conveying device 11 , the liquid spraying device 13 , the lamination device 15 and the control system 17 therein. The film body 200 is disposed on the laminating device 15 . The control...

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PUM

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Abstract

The invention discloses a film sticking equipment. The film sticking equipment comprises a conveying device for conveying printed circuit boards to be stuck with films, a film pressing roller, a liquid spraying roller and a liquid absorbing roller, wherein the liquid spraying roller humidifies the surface of the printed circuit board; the liquid absorbing roller homogenizes the liquid distribution at the surface of the printed circuit board; and the film pressing roller presses a film the homogenized printed circuit board surface. In the film sticking equipment, the liquid spraying roller and the liquid absorbing roller are additionally arranged; the liquid spraying roller humidifies the surface of the printed circuit board and the liquid absorbing roller homogenizes the liquid distribution at the surface of the printed circuit board, so that air bubbles caused by concave-convex surface of the printed circuit board and gaps between circuits are removed, absolute vacuum is ensured to be formed between the surface of the printed circuit board and the stuck film when the film is stuck, and the film sticking yield is improved. Simultaneously the invention further provides a film sticking process using the film sticking equipment.

Description

technical field [0001] The invention relates to a film sticking device and a film sticking process thereof, in particular to a wet film sticking device for a printed circuit board and a film sticking process using the film sticking device. Background technique [0002] With the rapid development of manufacturing technology in the printed circuit board industry, flexible printed circuit boards and soft-rigid printed circuit boards have been widely used, and the sophistication and complexity of circuit design have been greatly improved. Therefore, higher requirements are put forward for the printed circuit board manufacturing process. Require. In the plate-making process of circuit film for printed circuit boards, it is necessary to press and apply imaging dry film on the surface of copper foil. At present, the widely used hard board film laminating process, that is, the way of hot roller pressing dry film and copper foil-clad circuit board embryonic board has been It cannot ...

Claims

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Application Information

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IPC IPC(8): B32B37/10
Inventor 冉彦祥
Owner MEIZHOU ZHIHAO ELECTRONICS TECH
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