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Circuit board browning solution for high-temperature halogen-free board

A board and circuit technology, applied in the field of circuit board browning solution, can solve the problems of poor adhesion between the inner copper surface of the circuit board and the polymer material, high working temperature of the browning solution, poor tear strength, etc., and achieve the goal of working Low temperature, good tear strength, good moisture resistance

Inactive Publication Date: 2013-01-23
东莞市富默克化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the working temperature of the above browning solution is high, the working time is long, the service life is short, and the bonding force between the copper surface of the inner layer of the circuit board and the polymer material obtained is not good, resulting in poor tear strength, poor moisture resistance, and poor acid resistance.

Method used

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  • Circuit board browning solution for high-temperature halogen-free board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 30g of hydrogen peroxide with a mass concentration of 30%, 880g of deionized water, 10g of sulfuric acid with a mass concentration of 98%, and 10g of phosphoric acid with a mass concentration of 80% to the reactor in sequence, and stir evenly; Add 1g of azole, 5g of 1,2,4-aminonaphtholsulfonic acid, 1g of 2,4-dimethylthiazole, add deionized water to make up to 1L, and stir evenly to obtain a circuit board suitable for high temperature and halogen-free boards Browning solution.

[0029] The circuit board browning liquid suitable for high temperature and halogen-free boards prepared in this example can work below 35°C, has a bite loss of 60 micinch (microinch) in 45 seconds, and has a long service life.

Embodiment 2

[0031] In reactor, adding mass concentration successively is that 30% hydrogen peroxide 50g, deionized water 800g, mass concentration are 98% sulfuric acid 30g, mass concentration are 60% nitric acid 35g, stir; Continue to add 4 -Methylthiazole 3g, 1,3-propanedisulfonic acid disodium salt 3g, ammonium sulfate hydrochloride 3g, add deionized water to make the volume to 1L, stir evenly, and you can get the circuit board browning suitable for high temperature and halogen-free boards liquid.

[0032] The circuit board browning liquid suitable for high temperature and halogen-free boards prepared in this example can work below 35°C, has a bite loss of 70 micinch (microinch) in 45 seconds, and has a long service life.

Embodiment 3

[0034] Add 70g of hydrogen peroxide with a mass concentration of 30%, 800g of deionized water, 30g of sulfuric acid with a mass concentration of 98%, and 30g of hydrochloric acid with a mass concentration of 36% in the reactor, and stir evenly; Add 2 g of azole, 2 g of ethyl p-toluenesulfonate, and 2 g of 2-aminothiazole, add deionized water to make up to 1 L, and stir evenly to obtain a circuit board browning solution suitable for high-temperature, halogen-free boards.

[0035] The circuit board browning liquid suitable for high temperature and halogen-free boards prepared in this example can work below 35°C, has a bite loss of 70 micinch (microinch) in 45 seconds, and has a long service life.

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Abstract

The invention belongs to the technical field of processing of circuit boards, and particularly relates to a circuit board browning solution for a high-temperature halogen-free board, which comprises the following raw materials: 20-100 g / L acid, 30-100 g / L oxydol, 1-5 g / L corrosion inhibitor, 1-5 g / L first compound disclosed in the specification, 1-5 g / L second compound disclosed in the specification and the balance of deionized water. The circuit board browning solution provided by the invention has the advantages of low working temperature (can work at the temperature of below 35 DEG C), short working time (the corrosion amount for 45 seconds is only 60-80 micinch), and long service life. The circuit board prepared by the browning solution provided by the invention has the advantages of high tearing strength, favorable moisture resistance and favorable acid resistance, appears uniform brown on the copper surface, and can not generate a pink ring.

Description

technical field [0001] The invention belongs to the technical field of circuit board treatment agents, and in particular relates to a circuit board browning solution suitable for high-temperature, halogen-free plates. Background technique [0002] The function of the circuit board browning solution is to produce a uniform surface roughness and a brown organic metal film on the pretreated copper surface, improve the adhesion between the inner copper surface of the circuit board and the polymer material, and be used in the lamination of multilayer boards. Provide enough bonding strength to prevent interlayer separation and pink circle after lamination. [0003] For example, the Chinese invention patent with the patent number of 200410026849.2 introduces a browning treatment solution for improving the adhesion between the copper surface of the inner layer of the circuit board and the polymer material. The browning treatment solution contains sulfuric acid, hydrogen peroxide, ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C22/52C23F1/18
Inventor 王维仁伊洪坤
Owner 东莞市富默克化工有限公司