X-ray inspection device, method and system

Abstract

An X-ray inspection apparatus (100) previously acquires and stores a mask thickness in a cream solder printing as a thickness of the solder applied on the board. In a cross-section parallel to a board surface, a range in a height direction is set as an inspection target from the mask thickness of the inspection target board, and the number of cross-sections (N) is specified (S801). The X-ray inspection apparatus (100) measures an area (S) and roundness (T) of the solder in an inspection window for each cross-section (S807 to S819). When the minimum values of the area (S) and roundness (T) are not lower than reference values, the X-ray inspection apparatus (100) determines that the soldering of the inspection window is nondefective (S821 and S823). When one of the minimum values of the area (S) and roundness (T) is lower than the reference value, the X-ray inspection apparatus (100) determines that the soldering of the inspection window is defective (S821 and S823).

Description

technical field [0001] The present invention relates to an X-ray inspection device, an X-ray inspection method, an X-ray inspection program, and an X-ray inspection system for inspecting an inspection object using X-rays. In particular, the present invention relates to an X-ray inspection device, an X-ray inspection method, an X-ray inspection program, and an X-ray inspection system used for inspecting whether the connection between a printed board and a circuit component is good or not. Background technique [0002] X-ray CT (Computed Tomography: Computed Tomography) is often used to inspect the soldering state of printed circuit boards (hereinafter simply referred to as "boards") on which components are soldered. In X-ray CT, an object is photographed with X-rays from various directions, and a plurality of fluoroscopic images showing the distribution of the degree of absorption (attenuation) of X-rays are acquired. Furthermore, reconstruction processing is performed based...

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Problems solved by technology

[0006] However, the method disclosed in Patent Document 1 has a problem in that if the tomographic image used for good or bad judgment is not properly determined, the inspection accuracy will be reduced.

[0008] In addition, in the method of Patent Document 1, there is a problem that the boundary between the solder and the solder ball cannot be determined based only on the height from the wiring pattern, and an appropriate inspection position cannot be determined.

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