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Wafer lens array and method for manufacturing the same

Inactive Publication Date: 2011-09-21
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That said, there is the problem that a stacked lens array has a fully mated portion and a partially mated portion
This causes a reduction in the characteristics of the lens unit

Method used

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  • Wafer lens array and method for manufacturing the same
  • Wafer lens array and method for manufacturing the same
  • Wafer lens array and method for manufacturing the same

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Embodiment Construction

[0041] The contents of the present invention are described in detail below. In this specification, a numerical range indicated by the phrase "a number to another number" means that the range falls between the preceding number indicating the lower limit of the range and the following number indicating the upper limit of the range.

[0042] In-wafer lens array of the present invention includes a plurality of lens parts arranged one-dimensionally or two-dimensionally, a base part connecting the lens parts, and a gap part, wherein each of the lens surfaces in the lens part has one or more curved surfaces, and the gap part The portion is a portion protruding outside the inner edge of the lens portion, and the inner surface of the gap portion expands from one side near the lens portion to the other side. The inner edge of the surface of the gap is positioned beyond the inner edge of the base of the gap. Below, according to Figures 3 to 6 The invention is described. image 3 A cr...

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PUM

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Abstract

A wafer lens array comprising a plurality of lens sections arranged one-dimensionally or two-dimensionally, a substrate section connecting the lens sections, and gap sections, wherein the lens surfaces in the lens section each have one or more curved surfaces; the gap section is a part projecting from outside than the inner edge of the lens section; and the inner surfaces of the gap sections are spread from a side near the lens section to the other side.

Description

technical field [0001] The present invention relates to a wafer lens array and a stacked wafer lens array. The present invention also relates to a mold for manufacturing a wafer lens array and an apparatus for manufacturing a wafer lens array. Furthermore, the invention relates to a method for manufacturing a wafer lens array. Background technique [0002] Currently, portable terminals of electronic devices such as mobile phones and PDAs (Personal Digital Assistants) are equipped with image pickup units having a small and thin shape. [0003] Such an image pickup unit generally includes a solid-state image pickup device such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and is equipped with a lens that forms an image on the solid-state image pickup device. As mobile terminals become smaller and thinner, image pickup units mounted on the mobile terminals are also required to achieve size and thickness reducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B3/00G02B1/04B29C33/00
CPCG02B3/0031B29L2011/0016B29C43/021G02B3/005G02B3/0056
Inventor 米山聪松野亮
Owner FUJIFILM CORP