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High-reliability packaging support structure of light emitting device

A technology of light-emitting devices and packaging brackets, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as insufficient bonding force and affect the reliability of light-emitting diodes, and achieve the effect of improving reliability

Inactive Publication Date: 2013-12-11
SDI CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the existing light-emitting diode packaging structure such as the reference case, the front surface of the bracket (40) used to combine with the insulating material (50) is designed to be coplanar, that is, the chip-carrying lead frame (46) of the bracket (40), the front, The upper surface of the negative electrode lead frame (42, 44) is in the same plane structure, so it is easy to cause insufficient bonding force with the support (40) due to the shrinkage and expansion of the insulating material (50) during molding, and the insulating material A gap is formed between (50) and the support (40), so that water vapor can easily enter the crystal-bonding region (52) surrounded by the insulating material (50), and affect the reliability of the light-emitting diode.

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Embodiment Construction

[0028] The present invention provides a high-reliability light-emitting device packaging bracket structure with step difference, please refer to Figures 1 to 3 , it can be seen from the figure that the light-emitting device packaging bracket structure of the present invention includes a bracket (10) and an optical cup body (20), the bracket (10) forms a base (12) and a plurality of 12) Conductive pins (14) for electrical connection, wherein the conductive pins (14) can extend horizontally relative to the base (12), so that the packaging support structure is designed to be thinner, and can be used for thinner Screens and TVs, etc., the other conductive pin (14) can also be bent relative to the base (12), so that the packaging bracket structure is suitable for different design occasions, and a convex shape is formed on the top surface of the base (12). The protrusion (122) protrudes higher than the top surface of the conductive pin (14), so that there is a gap between the base ...

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Abstract

The invention provides a high-reliability packaging support structure of a light emitting device, which is mainly characterized in that a front surface of a support is provided with a raised part, thus heights of the base of the support and a conductive pin are different, thereby forming a non-coplanar structure state so as to improve the bonding force between the support and a light cup body and avoid existence of a gap between the support and the light cup body, thereby forming the high-reliability packaging support structure of the light emitting device.

Description

technical field [0001] The present invention relates to a light-emitting device packaging support structure, in particular to a high-reliability light-emitting device packaging support structure with step difference. Background technique [0002] Existing light-emitting diode packaging structures, such as the structure of Taiwan Invention No. I277223 "A LED Package with Low Thermal Resistance" (hereinafter referred to as the reference case), please refer to Figure 6 As shown, it has a support (40) formed with pins and an insulating material (50). The support (40) forms a positive lead frame (42), a negative lead frame (44) and a The chip carrying lead frame (46) of the diode chip (60), the insulating material (50) is molded to surround the frame (40), and a solid crystal region (52) is formed. [0003] However, in the existing light-emitting diode packaging structure such as the reference case, the front surface of the bracket (40) used to combine with the insulating materi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L2224/48091H01L2224/48247H01L2924/181
Inventor 刘俊杰王启全
Owner SDI CORPORATION