Thermoelectric device and forming method thereof
A thermoelectric device and thermoelectric technology, which can be applied in thermoelectric device parts, thermoelectric device manufacturing/processing, thermoelectric devices using only Peltier or Seebeck effect, etc. and other problems, to achieve the effect of small-scale cooling, improving cooling effect and improving cooling efficiency
Active Publication Date: 2011-10-12
SEMICON MFG INT (SHANGHAI) CORP +1
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[0007] The present invention provides a thermoelectric device to overcome the disadvantages of poor thermoelectric coolers in the prior art and the need to obtain current through additional connecting wires, which increases the wiring difficulty of the packaging structure
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[0036] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.
[0037] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, and it should not be limited here. The protection scope of the present invention. In addition, the three-dimensional space dimensions of length, width and depth should be inc...
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The invention provides a thermoelectric device and a forming method thereof. The thermoelectric device comprises a semiconductor substrate, a plurality of isolation structures, n-type thermoelectric structures, p-type thermoelectric structures, a plurality of first conducting electrodes and a plurality of second conducting electrodes, wherein the plurality of isolation structures run through the semiconductor substrate; the n-type thermoelectric structure and the p-type thermoelectric structure are arranged at two sides of each isolation structure respectively; the p-type thermoelectric structures and the n-type thermoelectric structures are arranged at intervals; the plurality of first conducting electrodes are arranged on the upper surface of the semiconductor substrate; the plurality of second conducting electrodes are arranged on the lower surface of the semiconductor substrate; the first conducting electrodes are electrically connected with the adjacent n-type thermoelectric structures and the adjacent p-type thermoelectric structures respectively, and the second conducting electrodes are electrically connected with the adjacent n-type thermoelectric structures and the adjacent p-type thermoelectric structures respectively; and the first conducting electrodes and the second conducting electrodes are used for connecting all the n-type thermoelectric structures with all the p-type thermoelectric structures in series. The thermoelectric device has the advantage of good cooling effect.
Description
technical field [0001] The invention relates to the application field of cooling of integrated circuit chips, in particular to a thermoelectric device and a forming method thereof. Background technique [0002] As the functions of integrated circuit chips become more and more powerful, the circuit structures they contain are also becoming larger and larger. Correspondingly, the heat generated by the operation of integrated circuit chips has also continued to increase. Overheating of an integrated circuit chip will cause its performance to degrade. Therefore, how to cool the integrated circuit chip has become an important subject concerned nowadays. [0003] A conventional method for cooling integrated circuit chips is to use convective fans and heat sinks for air cooling. However, the working method of air cooling will be subject to many limitations in the practical application of integrated circuit chips. For example, air cooling of integrated circuit chips is not suita...
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IPC IPC(8): H01L35/32H01L35/10H01L35/34H10N10/17H10N10/01H10N10/82
Inventor 三重野文健郭景宗
Owner SEMICON MFG INT (SHANGHAI) CORP