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Liquid crystal backboard and manufacturing method thereof

A manufacturing method and backplane technology, applied in optics, instruments, nonlinear optics, etc., to achieve the effects of improving production efficiency, reducing costs, and reducing design difficulty

Active Publication Date: 2011-11-02
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a method for manufacturing a liquid crystal backplane, so as to solve the problem of reducing the cost of the liquid crystal backplane while taking heat dissipation into account

Method used

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  • Liquid crystal backboard and manufacturing method thereof
  • Liquid crystal backboard and manufacturing method thereof
  • Liquid crystal backboard and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] like figure 2 As shown, it is a schematic diagram of the liquid crystal back panel of the first preferred embodiment of the present invention, which has two regions with different thermal conductivity. This embodiment is suitable for the situation where light is incident on the upper and lower sides. In this embodiment, the liquid crystal back panel includes a first region and a second region. The first area is located at both ends of the liquid crystal back panel, and the first area includes a first metal plate 201 . The second area is located in the middle of the liquid crystal back panel, and the second area includes a second metal plate 202 . The thermal conductivity of the first metal plate 201 at both ends of the liquid crystal back plate is greater than the thermal conductivity of the second metal plate 202 in the middle of the liquid crystal back plate. Such a design can meet the higher heat dissipation requirements at both ends of the liquid crystal backpla...

Embodiment 2

[0040] like Figure 4 As shown, this embodiment is a step further than Embodiment 1. Firstly, the first metal plate 401 at both ends of the liquid crystal back panel and the second metal plate 402 in the middle of the liquid crystal back panel are connected by welding. Then punch out depressions on the first metal plate 401 at both ends of the liquid crystal back panel according to the set mold shape, and then directly fix the light bar on the depressions. The length and area ratio of the first metal plate 401 and the second metal plate 402 can be set according to the heat dissipation simulation results. In this embodiment, brackets 404 are disposed in the recesses of the first metal plate 401 at both ends of the liquid crystal back panel, and the light bars 403 are fixed on the brackets 404 . In other cases, the light bar 403 may be directly fixed to the recesses of the first metal sheet 401 at both ends of the liquid crystal back panel.

Embodiment 3

[0042] like Figure 5 As shown, the difference between this embodiment and the first embodiment is that the first metal plates 501 at both ends of the liquid crystal back panel and the second metal plate 502 in the middle of the liquid crystal back plate are connected by riveting. Specifically, two first metal plates 501 are arranged at both ends of the liquid crystal backplane, and one second metal plate 502 is arranged in the middle of the liquid crystal backplane. The first metal plate 501 and the second metal plate 502 have a small overlap. . Then the first metal plate 501 and the second metal plate 502 are connected by riveting. The design of this embodiment adopts the method of riveting to connect, which improves the production efficiency. In the design of this embodiment, no screws are used to fix the segmented backplane, and no avoidance design is required for the place where the screws are fixed during design, which reduces the difficulty of design.

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Abstract

The invention discloses a liquid crystal backboard which has two regions having different heat conducting coefficients. The liquid crystal backboard comprises a first region and a second region, wherein the first region is positioned on the light incident side of the liquid crystal backboard and comprises a first metal plate; the second region comprises a second metal plate; and the heat conducting coefficient of the first metal plate is greater than that of the second metal plate. The middle part of the first metal plate is bulged, the middle part of the second metal plate is recessed, and the bulge of the first metal plate is matched with the recess of the second metal plate. On the light incident side of the liquid crystal backboard, the metal plate having the higher heat conducting coefficient is adopted, so the higher heat dissipation requirement of the light incident side of the liquid crystal backboard is met; and in the residual region of the liquid crystal backboard, the cheap metal plate is adopted. Due to the design of the liquid crystal backboard, high heat dissipation performance is achieved and the cost of the liquid crystal backboard is reduced.

Description

【Technical field】 [0001] The invention relates to a liquid crystal backboard, and also relates to a manufacturing method of the liquid crystal backboard. 【Background technique】 [0002] In recent years, liquid crystal display modules have been more and more widely used in people's daily life, such as liquid crystal displays of LCD TVs, notebook computers and desktop computers. Since the internal components of the liquid crystal display module are sensitive to temperature, coupled with the complexity of the internal structure, high requirements are placed on heat dissipation. At the same time, poor heat dissipation will also have a great impact on the stability and life of product performance. [0003] like figure 1 As shown, in the existing liquid crystal display module, the backplane is generally simply made of aluminum or galvanized steel plate. The former is more expensive, while the latter has a general heat dissipation effect. In the actual measurement, it is found ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13
CPCG02F1/13G02F1/133308Y10T29/49826G02F1/133314G02F1/133628
Inventor 萧宇均俞刚
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD