Organic light-emitting diode (OLED) display device, package structure and package method

Abstract

The invention relates to an organic light-emitting diode (OLED) display device, a package structure and a package method. The package structure for the OLED display device comprises an uncut glass package cover plate at a bottom and an uncut glass substrate at a top. A plurality of OLED units are arranged and attached to the lower part of the glass substrate according to a matrix structure. A circle of sintered glass is arranged outside the four edges of each OLED unit, connected between the glass package cover plate and the glass substrate and used for sealing each OLED unit in a closed space formed by the glass package cover plate, the glass substrate and the sintered glass. The four edges of each of the uncut glass package cover plate and the uncut glass substrate are provided with ultraviolet (UV) resin for sealing all the OLED units in the closed space formed by the glass package cover plate, the glass substrate and the UV resin. The invention has the advantage that: better sealing effects are achieved by the package structure and the package method thereof for the OLED display device adopting the sintered glass.

Description

technical field [0001] The invention relates to plane display technology, in particular to the packaging technology of an organic light-emitting device (OLED). Background technique [0002] Encapsulation technology is a core technology of OLED technology, because the OLED unit itself is very sensitive to water vapor and oxygen, and if it comes into contact with water vapor or oxygen, it will cause rapid degradation of the OLED unit. Traditional OLED packaging structures such as figure 1 As shown, UV resin 2 is used to seal OLED unit 6, but since UV resin 2 still has a certain degree of air permeability, desiccant 7 is generally attached to the inside of packaging glass cover plate 1 and glass substrate 5, so as to Enhance the ability to absorb water vapor and oxygen. [0003] In the existing industrial production process, in order to form such as figure 1 The OLED display device 3 shown is usually formed on a large packaging glass cover plate 1 with several OLED display d...

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Problems solved by technology

[0004] Before cutting, it is necessary to bond the glass substrate 5, OLED unit 6, and encapsulation glass cover plate 1 of the OLED display together through UV resin 2, and seal the glass substrate 5 and the encapsulation glass cover plate 1. The desiccant 7 is pasted in the cavity. In the packaging process, in order to cure the UV resin 2, it is necessary to use a UV lamp to irradiate the UV resin 2, but the irradiation of the UV lamp will damage the organic light-emitting layer of the OLED unit 6. 2. During curing, the UV lamp irradiates the organic light-emitting layer 5, and measures need to be taken to prevent the UV lamp from irradiating the OLED unit 6. In the prior art, a mask is used to solve this problem, and a mask is used to block the places that cannot be irradiated.

[0005] Fused glass has good sealing performance, and can maintain sealing performance within 7000 hours at 85°C and 85% relative humidity, which is far greater than the sealing performance of existing UV resins. However, due to some materials inside OLED displays such as organic The light-emitting layer cannot withstand high temperatures, so frit glass will affect the performance of other layers when it is fritted and sealed at high temperature. Therefore, in the existing OLED technology field, there has not been a use of frit glass as a sealing material to seal OLED units.

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